The **ATS-19G-95-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, which is designed to reduce pressure drop and maximize thermal performance in high-velocity airflow environments. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | **pushPIN™** (Plastic pins with springs) | | **Thermal Resistance (Flowing)** | 7.29 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 1.80 °C/W (at high velocity) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Pin Pitch** | 1.14 mm | | **Fin Style** | Straight Fin | --- ## 2. Key Design Features ### A. maxiFLOW™ Geometry The "G" in the part number indicates the maxiFLOW™ design. Unlike standard rectangular heat sinks, these feature a spread fin pattern that: * Reduces air resistance (pressure drop). * Increases the surface area exposed to the air stream. * Improves thermal transfer from the base to the fins. ### B. pushPIN™ Attachment System The **-R0** suffix refers to the specific attachment kit. This system uses: * **Compression Springs:** Ensure consistent pressure on the processor or component for optimal thermal interface contact. * **Plastic Pins:** Designed to fit into pre-drilled holes on the PCB (typically 3.00mm holes). ### C. Thermal Interface Material (TIM) This part typically comes with a pre-applied thermal interface material to simplify the assembly process. In this specific configuration (**C2**), it indicates the use of high-performance thermal grease or a phase-change material designed for high heat dissipation. --- ## 3. Application Use Cases The ATS-19G-95-C2-R0 is commonly used to cool high-heat electronic components such as: 1. **CPUs and GPUs:** In embedded systems or industrial PCs. 2. **FPGAs/ASICs:** In telecommunications and networking equipment. 3. **Power Modules:** Where space is constrained but airflow is available. --- ## 4. Part Number Breakdown | Code Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **19G** | maxiFLOW™ Series Product Line | | **95** | Specific geometry/fin configuration | | **C2** | Thermal Interface Material / Finish Code | | **R0** | Revision / Hardware kit version |