The **ATS-19H-07-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for electronic devices that require efficient thermal management. --- ## 1. Technical Specifications The part number encodes specific data about the physical and thermal properties of the heat sink. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 16.97 °C/W (at 100 LFM) | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height** | 12.70 mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Design Components ### A. pushPIN™ Attachment Unlike adhesive tapes or clips, this unit uses a **Push-Pin** system. * **Mechanism:** Plastic or brass pins with springs are pushed through pre-drilled holes in the PCB. * **Benefit:** Provides consistent pressure on the processor/chip, improving heat transfer and allowing for easy removal/rework without damaging the board. ### B. Fin Design: XC Cut (Cross-Cut) The "H" in the part number usually indicates the fin pattern. * **Flow:** Designed for "straight-line" airflow but the cross-cut patterns allow for some omnidirectional air movement. * **Efficiency:** Maximizes surface area in a low-profile (12.7mm) height, making it suitable for dense rack-mount servers or compact networking hardware. ### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. * **Function:** Fills microscopic air gaps between the heat sink and the electronic component (CPU/GPU/FPGA). * **Advantage:** Eliminates the need for manual thermal paste application, ensuring a uniform layer and reducing assembly time. --- ## 3. Common Applications This specific heat sink is typically found in: * **Networking Equipment:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Cooling MOSFETs or power conversion modules. * **Telecommunications:** Base stations and signal processing units. ---