ATS-19H-129-C2-R0
AI

The **ATS-19H-129-C2-R0** is a high-performance electronic cooling component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient thermal management of surface-mount electronic components.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific part:
| Feature | Specification |
| :--- | :--- |
| **Product Series** | pushPIN™ |
| **Material** | Aluminum |
| **Fin Type** | Straight Fin |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W)** | 54.00 mm x 54.00 mm |
| **Height (Height Off Base)** | 10.00 mm |
| **Thermal Resistance (Flowing)** | 2.50 °C/W @ 200 LFM |
| **Thermal Resistance (Static)** | 8.68 °C/W @ 0 LFM |
| **Thermal Interface Material** | T766 (Pre-applied) |
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### 2. Physical Design & Construction
* **Fin Configuration:** The **Straight Fin** design allows for maximum airflow through the sink, which is ideal for systems with high-velocity air cooling.
* **Low Profile:** With a height of only **10.00 mm**, it is suitable for dense PCB layouts or 1U server chassis where vertical space is limited.
* **Material:** Made from **Blue Anodized Aluminum**, providing high thermal conductivity and corrosion resistance.
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### 3. Mounting System (pushPIN™)
The "C2" in the part number refers to the specific attachment hardware:
1. **Springs:** Uses a stainless steel spring to provide consistent pressure.
2. **Pins:** Plastic or brass pins secure the heat sink to pre-drilled holes in the PCB.
3. **Pressure:** This system ensures the heat sink remains in tight contact with the chip, optimizing heat transfer even during vibration or mechanical shock.
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### 4. Thermal Performance Data
Performance varies based on the airflow (measured in Linear Feet per Minute - LFM):
| Air Velocity (m/s) | 0.5 (100 LFM) | 1.0 (200 LFM) | 2.0 (400 LFM) | 3.0 (600 LFM) |
| :--- | :--- | :--- | :--- | :--- |
| **Thermal Resistance** | 8.68 °C/W | 2.50 °C/W | 1.59 °C/W | 1.25 °C/W |
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What are the PCB hole requirements for the pushPIN mounting system?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?
- ⤷ Is there a version of this heat sink with a different height or fin type?