## Electronic Specifications: ATS-19H-40-C2-R0 The **ATS-19H-40-C2-R0** is a high-performance aluminum heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **maxiFLOW™** series, designed specifically for cooling electronic components such as processors, FPGAs, and ASICs. --- ### 1. General Specifications This part is defined by its thermal resistance properties and physical dimensions to ensure heat is efficiently moved away from sensitive electronics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Thermal Performance Data The primary "electronic" function of this part is **Thermal Resistance**, measured in degrees Celsius per Watt (°C/W). Lower values indicate better cooling performance. | Airflow Velocity (LFM) | Thermal Resistance (Unducted) | | :--- | :--- | | 1.0 m/s (200 LFM) | 14.56 °C/W | | 2.0 m/s (400 LFM) | 9.32 °C/W | | 3.0 m/s (600 LFM) | 7.20 °C/W | --- ### 3. Mechanical Dimensions Precision in dimensions ensures the heat sink fits the PCB layout and aligns with the component it is cooling. * **Width (X):** 57.00 mm * **Length (Y):** 57.00 mm * **Height (Z):** 15.00 mm * **Pitch (Fin spacing):** Fine Pitch * **Pattern:** Square (as indicated by the 57x57 footprint) --- ### 4. Key Electronic Components Features * **pushPIN™ Attachment:** This specific mounting system uses a flexible, spring-loaded mechanism that ensures consistent pressure on the electronic chip, improving heat transfer while preventing damage to the PCB. * **T766 TIM:** The part comes with a pre-applied thermal interface material, which fills microscopic air gaps between the component surface and the heat sink base to maximize thermal conductivity. * **Blue Anodized Finish:** Not only provides corrosion resistance but also increases surface emissivity, which helps slightly with radiative cooling in electronic enclosures. ---