Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-19H-41-C2-R0

  • AI
    The **ATS-19H-41-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin pattern, and material properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ HS | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass/Plastic) | | **Fin Type** | Straight Fin | | **Fin Pitch** | Fine | ### Physical Dimensions Proper clearance is required on the PCB to accommodate this part: * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height:** 20.00 mm * **Push-Pin Hole Spacing:** 38.00 mm ### Thermal Performance Thermal resistance determines how effectively the part moves heat away from the component. This varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 10.07 | | **300 (1.5 m/s)** | 3.20 | | **500 (2.5 m/s)** | 2.00 | | **700 (3.5 m/s)** | 1.58 | --- ### Key Components of the Part 1. **High-Performance Fin Design:** The "Straight Fin" configuration is optimized for directed airflow environments (fans), providing a high surface area to volume ratio. 2. **Push-Pin Mounting:** This uses a spring-loaded mechanism that ensures consistent pressure between the heatsink and the component, maximizing thermal transfer. 3. **Pre-applied Thermal Interface Material (TIM):** This specific model typically comes with **T766** thermal tape or grease pre-applied to the base to eliminate air gaps. 4. **Blue Anodized Coating:** The anodization provides corrosion resistance and improves thermal emissivity. ### Typical Applications * **Computing:** Northbridge/Southbridge chips on motherboards. * **Industrial:** Power supplies and motor controllers. * **Telecommunications:** High-speed routers and switches. ---
    ✨ Follow-up Questions
    • ⤷ What are the differences between push-pin and adhesive mounting for this heatsink?
    • ⤷ Does this model support custom thermal interface materials?
    • ⤷ How do I calculate if this heatsink is sufficient for a 15W TDP chip?