ATS-19H-41-C2-R0
AI

The **ATS-19H-41-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### Technical Specifications
The part number follows a specific nomenclature used by ATS to define the dimensions, fin pattern, and material properties.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ HS |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass/Plastic) |
| **Fin Type** | Straight Fin |
| **Fin Pitch** | Fine |
### Physical Dimensions
Proper clearance is required on the PCB to accommodate this part:
* **Length:** 45.00 mm
* **Width:** 45.00 mm
* **Height:** 20.00 mm
* **Push-Pin Hole Spacing:** 38.00 mm
### Thermal Performance
Thermal resistance determines how effectively the part moves heat away from the component. This varies based on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **100 (0.5 m/s)** | 10.07 |
| **300 (1.5 m/s)** | 3.20 |
| **500 (2.5 m/s)** | 2.00 |
| **700 (3.5 m/s)** | 1.58 |
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### Key Components of the Part
1. **High-Performance Fin Design:** The "Straight Fin" configuration is optimized for directed airflow environments (fans), providing a high surface area to volume ratio.
2. **Push-Pin Mounting:** This uses a spring-loaded mechanism that ensures consistent pressure between the heatsink and the component, maximizing thermal transfer.
3. **Pre-applied Thermal Interface Material (TIM):** This specific model typically comes with **T766** thermal tape or grease pre-applied to the base to eliminate air gaps.
4. **Blue Anodized Coating:** The anodization provides corrosion resistance and improves thermal emissivity.
### Typical Applications
* **Computing:** Northbridge/Southbridge chips on motherboards.
* **Industrial:** Power supplies and motor controllers.
* **Telecommunications:** High-speed routers and switches.
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- ⤷
What are the differences between push-pin and adhesive mounting for this heatsink?
- ⤷ Does this model support custom thermal interface materials?
- ⤷ How do I calculate if this heatsink is sufficient for a 15W TDP chip?