The **ATS-19H-63-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Below are the primary specifications for this component: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Flow)** | 2.03°C/W @ 100 LFM | | **Thermal Resistance (Static)** | 1.60°C/W @ 200 LFM | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Fin Style** | Straight Fin | --- ### 2. Key Design Features #### A. pushPIN™ Attachment Unlike traditional adhesive tapes or simple clips, this model uses the **pushPIN™** system. This provides: * **Constant Pressure:** Ensures a consistent interface between the heat sink and the component for optimal heat transfer. * **Secure Mounting:** Uses a spring-loaded mechanism that snaps into pre-drilled holes on the PCB. * **Easy Installation:** Allows for tool-free or simple screwdriver installation depending on the pin type. #### B. Thermal Performance The "63" in the part number refers to a specific performance profile. The straight-fin design is optimized for **forced air cooling** (fans). The low thermal resistance (as low as 1.60°C/W) indicates it is highly efficient at moving heat away from the die. #### C. Material and Coating * **Aluminum:** Provides a lightweight solution with high thermal conductivity. * **Blue Anodize:** The coating isn't just for aesthetics; it increases the surface emissivity, slightly improving radiation heat transfer and protecting the aluminum from corrosion. --- ### 3. Usage Context This heat sink is typically used in the following electronic environments: 1. **Telecommunications:** Cooling high-speed networking chips. 2. **Power Electronics:** Dissipating heat from MOSFETs or IGBTs. 3. **Embedded Systems:** Industrial PCs where space is limited but heat density is high. --- ### 4. Part Number Breakdown `ATS-19H-63-C2-R0` * **ATS:** Advanced Thermal Solutions (Manufacturer). * **19:** Series designation. * **H:** High-performance version. * **63:** Specific fin geometry and height configuration. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision or packaging code.