ATS-19H-64-C2-R0
AI

The **ATS-19H-64-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Material** | Aluminum (Lightweight and thermally conductive) |
| **Fin Type** | Straight Fin |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Resistance** | 9.39°C/W (at 100 LFM) to 1.30°C/W (at 700 LFM) |
| **Coating/Finish** | Blue Anodized |
| **Dimensions** | 45mm x 45mm x 25mm |
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### 2. Physical Design Features
* **Heat Sink Profile:** The "Straight Fin" design allows for consistent airflow across the surface area, making it ideal for systems with high-velocity air cooling.
* **Material (Aluminum):** Provides an excellent balance between thermal conductivity, weight reduction, and cost-effectiveness.
* **Blue Anodized Finish:** Not only provides aesthetic appeal but also increases surface emissivity and protects the aluminum from corrosion.
### 3. Mounting System: pushPIN™
The suffix in the part number indicates the use of the **pushPIN™** attachment mechanism. This is a critical electronic hardware feature:
* **Pre-assembled:** Includes a flexible spring and a push-pin.
* **Reliability:** Ensures consistent pressure across the interface material (TIM) for optimal heat transfer.
* **Ease of Install:** Allows for quick, tool-free installation into pre-drilled holes in the PCB.
### 4. Thermal Performance
The efficiency of this part depends on the airflow (Linear Feet per Minute - LFM). As airflow increases, the thermal resistance drops significantly:
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 9.39 |
| 400 | 2.0 | 2.01 |
| 700 | 3.5 | 1.30 |
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### 5. Part Number Breakdown (Nomenclature)
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **19:** Series Identification
* **H:** High Profile / Height variant
* **64:** Specific dimension/fin configuration code
* **C2:** Blue Anodized finish
* **R0:** Revision/RoHS compliance status
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What is the recommended Thermal Interface Material (TIM) for this heat sink?
- ⤷ How do I calculate the required airflow for a 10W component using this heat sink?
- ⤷ Are there alternative mounting options if my PCB does not have pushPIN holes?