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  • ATS-19H-64-C2-R0

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    The **ATS-19H-64-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Material** | Aluminum (Lightweight and thermally conductive) | | **Fin Type** | Straight Fin | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 9.39°C/W (at 100 LFM) to 1.30°C/W (at 700 LFM) | | **Coating/Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 25mm | --- ### 2. Physical Design Features * **Heat Sink Profile:** The "Straight Fin" design allows for consistent airflow across the surface area, making it ideal for systems with high-velocity air cooling. * **Material (Aluminum):** Provides an excellent balance between thermal conductivity, weight reduction, and cost-effectiveness. * **Blue Anodized Finish:** Not only provides aesthetic appeal but also increases surface emissivity and protects the aluminum from corrosion. ### 3. Mounting System: pushPIN™ The suffix in the part number indicates the use of the **pushPIN™** attachment mechanism. This is a critical electronic hardware feature: * **Pre-assembled:** Includes a flexible spring and a push-pin. * **Reliability:** Ensures consistent pressure across the interface material (TIM) for optimal heat transfer. * **Ease of Install:** Allows for quick, tool-free installation into pre-drilled holes in the PCB. ### 4. Thermal Performance The efficiency of this part depends on the airflow (Linear Feet per Minute - LFM). As airflow increases, the thermal resistance drops significantly: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 9.39 | | 400 | 2.0 | 2.01 | | 700 | 3.5 | 1.30 | --- ### 5. Part Number Breakdown (Nomenclature) * **ATS:** Advanced Thermal Solutions (Manufacturer) * **19:** Series Identification * **H:** High Profile / Height variant * **64:** Specific dimension/fin configuration code * **C2:** Blue Anodized finish * **R0:** Revision/RoHS compliance status
    ✨ Follow-up Questions
    • ⤷ What is the recommended Thermal Interface Material (TIM) for this heat sink?
    • ⤷ How do I calculate the required airflow for a 10W component using this heat sink?
    • ⤷ Are there alternative mounting options if my PCB does not have pushPIN holes?