ATS-19H-65-C2-R0
AI

The **ATS-19H-65-C2-R0** is a high-performance thermal management component, specifically an electronic **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Dimensions (L x W)** | 45mm x 45mm |
| **Height** | 25mm |
| **Material** | Aluminum |
| **Attachment Method** | Push-Pin (Spring-loaded) |
| **Thermal Resistance** | 1.48 °C/W (at 100 LFM) |
| **Fin Style** | Straight Fin |
| **Finish** | Blue Anodized |
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### 2. Key Electronic Features
The "C2" and "R0" suffixes in the part number designate specific material and environmental compliance standards.
* **Thermal Interface Material (TIM):** This part comes pre-applied with **T766** phase-change material. This ensures a low-resistance thermal path between the electronic chip and the aluminum base.
* **Push-Pin Attachment:** Instead of messy adhesives, it uses a mechanical push-pin system. This is critical for electronics where the PCB (Printed Circuit Board) has pre-drilled holes, allowing for consistent pressure and easy maintenance.
* **Blue Anodized Coating:** The finish is not just aesthetic; anodizing increases the surface emissivity and protects the aluminum from environmental corrosion.
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### 3. Thermal Performance Comparison
Heat sinks are rated by their thermal resistance (measured in °C/W). A lower value indicates better cooling efficiency.
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 1.48 |
| 300 (1.5 m/s) | 0.88 |
| 500 (2.5 m/s) | 0.73 |
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### 4. Part Number Breakdown
Understanding the nomenclature helps in identifying variants:
* **ATS:** Advanced Thermal Solutions (Brand)
* **19H:** Series/Family type
* **65:** Specific footprint/model code
* **C2:** Material/TIM code (T766)
* **R0:** Revision/RoHS compliance status
- ⤷What is the difference between blue anodized and black anodized heat sinks?
- ⤷ How do I calculate the required LFM for my specific chip?
- ⤷ What are the PCB hole diameter requirements for the ATS push-pin system?