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  • ATS-19H-65-C2-R0

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    The **ATS-19H-65-C2-R0** is a high-performance thermal management component, specifically an electronic **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 25mm | | **Material** | Aluminum | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 1.48 °C/W (at 100 LFM) | | **Fin Style** | Straight Fin | | **Finish** | Blue Anodized | --- ### 2. Key Electronic Features The "C2" and "R0" suffixes in the part number designate specific material and environmental compliance standards. * **Thermal Interface Material (TIM):** This part comes pre-applied with **T766** phase-change material. This ensures a low-resistance thermal path between the electronic chip and the aluminum base. * **Push-Pin Attachment:** Instead of messy adhesives, it uses a mechanical push-pin system. This is critical for electronics where the PCB (Printed Circuit Board) has pre-drilled holes, allowing for consistent pressure and easy maintenance. * **Blue Anodized Coating:** The finish is not just aesthetic; anodizing increases the surface emissivity and protects the aluminum from environmental corrosion. --- ### 3. Thermal Performance Comparison Heat sinks are rated by their thermal resistance (measured in °C/W). A lower value indicates better cooling efficiency. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 1.48 | | 300 (1.5 m/s) | 0.88 | | 500 (2.5 m/s) | 0.73 | --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS:** Advanced Thermal Solutions (Brand) * **19H:** Series/Family type * **65:** Specific footprint/model code * **C2:** Material/TIM code (T766) * **R0:** Revision/RoHS compliance status
    ✨ Follow-up Questions
    • ⤷What is the difference between blue anodized and black anodized heat sinks?
    • ⤷ How do I calculate the required LFM for my specific chip?
    • ⤷ What are the PCB hole diameter requirements for the ATS push-pin system?