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  • ATS-19H-69-C2-R0

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    The **ATS-19H-69-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic packages. It belongs to the *maxiFLOW™* series manufactured by **Advanced Thermal Solutions (ATS)**. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Anodized Blue) | | **Dimensions (L x W x H)** | 45.00mm x 40.00mm x 20.00mm | | **Thermal Resistance** | 3.90°C/W @ 200 LFM (Linear Feet per Minute) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Features and Design The ATS-19H-69-C2-R0 is engineered for efficient heat dissipation in constrained spaces. * **maxiFLOW™ Fin Pattern:** The design features a spread-fin pattern. Unlike straight-fin heatsinks, this geometry maximizes surface area and creates turbulence in the airflow, which significantly increases the cooling efficiency. * **pushPIN™ Attachment:** It utilizes a specialized spring-loaded mechanism that ensures even pressure across the processor or component. This prevents mechanical stress on the PCB while maintaining consistent contact for heat transfer. * **High Performance TIM:** It comes with **T766** thermal interface material pre-applied to the base. This material fills microscopic air gaps between the chip and the heatsink to lower thermal resistance. --- ### 3. Applications This part is typically found in high-reliability electronic environments where component density is high and airflow is critical: * **Networking Gear:** Routers, switches, and base stations. * **Computing:** High-speed processors, FPGAs (Field Programmable Gate Arrays), and GPUs. * **Power Electronics:** Voltage regulators and power modules that generate significant heat in a small footprint. --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying variations: * **ATS:** Manufacturer prefix (Advanced Thermal Solutions). * **19H:** Specific series/form factor identifier. * **69:** Indicates the specific fin height and spacing profile. * **C2:** Refers to the material finish (Blue Anodized). * **R0:** Revision or packaging code.
    ✨ Follow-up Questions
    • ⤷ How does the pushPIN™ attachment compare to traditional adhesive thermal tape?
    • ⤷ What is the importance of the LFM rating in determining if this heatsink is right for my project?
    • ⤷ Can this heatsink be used for components larger than 45x40mm?