ATS-19H-69-C2-R0
AI

The **ATS-19H-69-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic packages. It belongs to the *maxiFLOW™* series manufactured by **Advanced Thermal Solutions (ATS)**.
### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | maxiFLOW™ |
| **Material** | Aluminum (Anodized Blue) |
| **Dimensions (L x W x H)** | 45.00mm x 40.00mm x 20.00mm |
| **Thermal Resistance** | 3.90°C/W @ 200 LFM (Linear Feet per Minute) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Key Features and Design
The ATS-19H-69-C2-R0 is engineered for efficient heat dissipation in constrained spaces.
* **maxiFLOW™ Fin Pattern:** The design features a spread-fin pattern. Unlike straight-fin heatsinks, this geometry maximizes surface area and creates turbulence in the airflow, which significantly increases the cooling efficiency.
* **pushPIN™ Attachment:** It utilizes a specialized spring-loaded mechanism that ensures even pressure across the processor or component. This prevents mechanical stress on the PCB while maintaining consistent contact for heat transfer.
* **High Performance TIM:** It comes with **T766** thermal interface material pre-applied to the base. This material fills microscopic air gaps between the chip and the heatsink to lower thermal resistance.
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### 3. Applications
This part is typically found in high-reliability electronic environments where component density is high and airflow is critical:
* **Networking Gear:** Routers, switches, and base stations.
* **Computing:** High-speed processors, FPGAs (Field Programmable Gate Arrays), and GPUs.
* **Power Electronics:** Voltage regulators and power modules that generate significant heat in a small footprint.
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### 4. Part Number Breakdown
Understanding the nomenclature helps in identifying variations:
* **ATS:** Manufacturer prefix (Advanced Thermal Solutions).
* **19H:** Specific series/form factor identifier.
* **69:** Indicates the specific fin height and spacing profile.
* **C2:** Refers to the material finish (Blue Anodized).
* **R0:** Revision or packaging code.
- ⤷
How does the pushPIN™ attachment compare to traditional adhesive thermal tape?
- ⤷ What is the importance of the LFM rating in determining if this heatsink is right for my project?
- ⤷ Can this heatsink be used for components larger than 45x40mm?