The **ATS-19H-75-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed by Advanced Thermal Solutions (ATS) for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and features. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Base Part Number** | ATS-19H-75-C3-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Thermal Resistance** | 1.57°C/W (at 100 LFM) | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the part fits onto a PCB without interfering with neighboring components. * **Length (A):** 25.00 mm * **Width (B):** 25.00 mm * **Height (C):** 20.00 mm * **Pitch (E):** 30.00 mm (Distance between attachment pins) --- ### 3. Key Features and Electronic Functionality #### Thermal Performance This heatsink uses a **Fine Pitch design**, which increases the surface area for heat dissipation. The "C3" in the part number indicates a specific thermal performance grade and material composition (typically high-grade aluminum). #### Attachment System (pushPIN™) Instead of using messy thermal adhesives or tapes, this part uses a mechanical **Push-Pin** system. * **Springs:** Provides consistent pressure for optimal thermal interface material (TIM) contact. * **Reliability:** Mechanical fastening is more vibration-resistant than adhesive alone, making it suitable for industrial or automotive electronics. #### Material and Finish * **Aluminum Construction:** Offers a lightweight solution with high thermal conductivity. * **Blue Anodized Finish:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves radiative heat transfer. --- ### 4. Typical Applications * **CPU/GPU Cooling:** Small-scale processors or microcontrollers. * **Power Electronics:** Cooling for MOSFETs or Voltage Regulators. * **Telecommunications:** Network switches and routers where airflow is managed.