ATS-19H-79-C2-R0
AI

The **ATS-19H-79-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 25mm x 25mm x 30mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | ~2.63° C/W (at 200 LFM) |
| **Flow Orientation** | Cross-cut (High-performance fins) |
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### 2. Key Component Features
* **pushPIN™ Attachment:** This model uses a tool-free mounting system. It consists of a pin and a spring that provides a specific pressure (force) on the component to ensure maximum contact between the heat sink base and the chip.
* **High Performance Fins:** The fins are designed with a "cross-cut" pattern. This allows for multi-directional airflow, making it highly efficient in crowded PCB environments where air might not flow in a straight line.
* **Pre-applied Thermal Interface Material (TIM):** Most "C2" series parts come with a pre-applied thermal pad or phase-change material (usually T766) to ensure low thermal resistance at the interface without needing manual application of paste.
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### 3. Application Use-Cases
This heat sink is typically used in industrial and telecommunications hardware:
1. **FPGA/ASIC Cooling:** Ideal for small-form-factor chips that generate significant heat (approx. 5W to 15W).
2. **Embedded Systems:** Used in networking switches or routers where vertical space (30mm) is available.
3. **Power Electronics:** Cooling MOSFETs or power regulators in DC-DC converters.
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### 4. Comparison of Materials
The "C2" designation specifically refers to the material and finish combination.
| Material Code | Base Material | Coating | Benefit |
| :--- | :--- | :--- | :--- |
| **C1** | Aluminum | Clear Anodized | Standard protection |
| **C2** | Aluminum | Blue Anodized | Enhanced corrosion resistance & aesthetics |
| **C3** | Aluminum | Black Anodized | Best thermal radiation properties |
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What is the significance of the 30mm height for thermal dissipation in this model?
- ⤷ Does the ATS-19H-79-C2-R0 require a specific hole pattern on the PCB?
- ⤷ How does the pressure of the pushPIN affect cooling performance?