Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-19H-79-C2-R0

  • AI
    The **ATS-19H-79-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25mm x 25mm x 30mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | ~2.63° C/W (at 200 LFM) | | **Flow Orientation** | Cross-cut (High-performance fins) | --- ### 2. Key Component Features * **pushPIN™ Attachment:** This model uses a tool-free mounting system. It consists of a pin and a spring that provides a specific pressure (force) on the component to ensure maximum contact between the heat sink base and the chip. * **High Performance Fins:** The fins are designed with a "cross-cut" pattern. This allows for multi-directional airflow, making it highly efficient in crowded PCB environments where air might not flow in a straight line. * **Pre-applied Thermal Interface Material (TIM):** Most "C2" series parts come with a pre-applied thermal pad or phase-change material (usually T766) to ensure low thermal resistance at the interface without needing manual application of paste. --- ### 3. Application Use-Cases This heat sink is typically used in industrial and telecommunications hardware: 1. **FPGA/ASIC Cooling:** Ideal for small-form-factor chips that generate significant heat (approx. 5W to 15W). 2. **Embedded Systems:** Used in networking switches or routers where vertical space (30mm) is available. 3. **Power Electronics:** Cooling MOSFETs or power regulators in DC-DC converters. --- ### 4. Comparison of Materials The "C2" designation specifically refers to the material and finish combination. | Material Code | Base Material | Coating | Benefit | | :--- | :--- | :--- | :--- | | **C1** | Aluminum | Clear Anodized | Standard protection | | **C2** | Aluminum | Blue Anodized | Enhanced corrosion resistance & aesthetics | | **C3** | Aluminum | Black Anodized | Best thermal radiation properties |
    ✨ Follow-up Questions
    • ⤷ What is the significance of the 30mm height for thermal dissipation in this model?
    • ⤷ Does the ATS-19H-79-C2-R0 require a specific hole pattern on the PCB?
    • ⤷ How does the pressure of the pushPIN affect cooling performance?