The **ATS-19H-80-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions, Inc. (ATS). Below is a detailed breakdown of its specifications and design features. ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 1.88°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm | --- ### 2. Design and Construction The ATS-19H-80-C2-R0 is engineered for modern electronic cooling requirements, focusing on high heat dissipation in compact spaces. * **Fin Style:** It utilizes a **Fine-Pitch** design. This provides a larger surface area relative to its footprint, which is critical for forced-air cooling environments. * **Material:** Made from **Aluminum 6063**, which offers a high degree of thermal conductivity and is lightweight. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** (a high-performance thermal phase-change material) to ensure efficient heat transfer from the component to the sink. --- ### 3. Attachment Mechanism: pushPIN™ The "pushPIN" system is designed to provide secure attachment and consistent pressure on the heat source. * **Spring-Loaded:** It uses a flexible tension spring that ensures the heat sink stays in contact with the CPU or FPGA even during mechanical vibration. * **Tool-less Installation:** Designed for easy assembly on Printed Circuit Boards (PCBs) using pre-drilled holes. * **Compatibility:** The hardware is designed to accommodate various PCB thicknesses. --- ### 4. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (Unducted) | | :--- | :--- | | 100 (0.5 m/s) | 1.88 °C/W | | 300 (1.5 m/s) | 1.13 °C/W | | 500 (2.5 m/s) | 0.90 °C/W | --- ### 5. Common Applications This heat sink is commonly used for cooling: * **ASICs and FPGAs:** Used in networking and telecommunications equipment. * **Processors:** Low-to-mid TDP CPUs in industrial computing. * **Power Supplies:** Cooling high-density power modules.