The **ATS-19H-85-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series of high-performance heat sinks. Below is a detailed breakdown of its specifications and electronic application characteristics. --- ### 1. General Specifications | Feature | Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-19H-85-C2-R0 | | **Component Type** | Heat Sink | | **Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ | --- ### 2. Physical & Thermal Dimensions The "85" in the part number refers to a specific design profile within the series. * **Length/Width:** 36.83mm x 36.83mm * **Height:** 10.00mm (Low profile design) * **Fin Style:** Straight Fin (Optimized for high-velocity airflow) * **Material:** Aluminum (Black Anodized) * **Thermal Interface Material (TIM):** Pre-applied T766 (High performance) --- ### 3. Thermal Performance Thermal resistance indicates how effectively the part moves heat away from the semiconductor. This part is designed for varying airflow environments: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 8.98 | | 200 | 1.0 | 4.53 | | 300 | 1.5 | 3.32 | | 400 | 2.0 | 2.71 | --- ### 4. Mounting Mechanism: pushPIN™ This component uses the proprietary **pushPIN™** system, which is crucial for secure PCB attachment: * **Springs:** Stainless steel springs provide precise pressure to ensure optimal contact with the electronic chip. * **Attachment:** Designed for a **2-hole** mounting pattern. * **Material:** Brass or Plastic pins (depending on exact sub-revision) to ensure the sink does not shift during shipping or vibration. --- ### 5. Application Use Cases This part is typically used to cool the following electronic components: 1. **Processors (CPUs/GPUs):** Low-power embedded processors. 2. **ASICs/FPGAs:** Used in telecommunications and networking gear. 3. **Power Electronics:** Voltage regulators or motor drivers that generate significant heat in a small footprint. 4. **BGA Packages:** High-density ball grid array chips where space is limited. ---