ATS-19H-89-C2-R0
AI

The **ATS-19H-89-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
---
## 1. Technical Specifications
The part number provides specific details about the dimensions, thermal resistance, and material properties.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 30.00mm |
| **Attachment Type** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 7.94°C/W (Unducted Flow @ 100 LFM) |
| **Thermal Interface Material** | T766 (Pre-applied) |
---
## 2. Key Design Components
### A. The pushPIN™ Attachment System
Unlike adhesive-based heat sinks, this model uses a **pushPIN™** system. This consists of:
* **Plastic/Brass Pins:** Inserted through pre-drilled holes in the PCB.
* **Compression Springs:** Provide consistent downward pressure (approximately 20+ PSI) to ensure optimal contact with the electronic component.
### B. Fin Configuration
The "89" in the part number refers to a specific fin pattern.
* **High-Density Fins:** Designed to maximize surface area for heat exchange.
* **Cross-Cut Design:** Allows for multi-directional airflow, making it effective in environments where the direction of the cooling fan may vary.
### C. Thermal Interface Material (TIM)
The unit comes with **T766** pre-applied to the base. This is a phase-change material that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance.
---
## 3. Performance Summary
The efficiency of the ATS-19H-89-C2-R0 depends on the airflow velocity (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 7.94 |
| 200 | 1.0 | 2.77 |
| 300 | 1.5 | 1.61 |
| 500 | 2.5 | 0.98 |
---
## 4. Part Number Breakdown
```text
ATS - 19 - H - 89 - C2 - R0
| | | | | |
| | | | | +-- Revision Code
| | | | +------- Color/Finish (Blue Anodized)
| | | +------------ Fin Pattern/Geometry Code
| | +----------------- Height Code (H = 30mm)
| +---------------------- Component Series
+---------------------------- Advanced Thermal Solutions
```
- ⤷
How do I calculate the required airflow for this heat sink based on my chip's TDP?
- ⤷ What are the PCB hole requirements for the pushPIN attachment system?
- ⤷ Can this heat sink be used with a custom thermal paste instead of the pre-applied T766?