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  • ATS-19H-89-C2-R0

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    The **ATS-19H-89-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number provides specific details about the dimensions, thermal resistance, and material properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 30.00mm | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 7.94°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## 2. Key Design Components ### A. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a **pushPIN™** system. This consists of: * **Plastic/Brass Pins:** Inserted through pre-drilled holes in the PCB. * **Compression Springs:** Provide consistent downward pressure (approximately 20+ PSI) to ensure optimal contact with the electronic component. ### B. Fin Configuration The "89" in the part number refers to a specific fin pattern. * **High-Density Fins:** Designed to maximize surface area for heat exchange. * **Cross-Cut Design:** Allows for multi-directional airflow, making it effective in environments where the direction of the cooling fan may vary. ### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a phase-change material that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance. --- ## 3. Performance Summary The efficiency of the ATS-19H-89-C2-R0 depends on the airflow velocity (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 7.94 | | 200 | 1.0 | 2.77 | | 300 | 1.5 | 1.61 | | 500 | 2.5 | 0.98 | --- ## 4. Part Number Breakdown ```text ATS - 19 - H - 89 - C2 - R0 | | | | | | | | | | | +-- Revision Code | | | | +------- Color/Finish (Blue Anodized) | | | +------------ Fin Pattern/Geometry Code | | +----------------- Height Code (H = 30mm) | +---------------------- Component Series +---------------------------- Advanced Thermal Solutions ```
    ✨ Follow-up Questions
    • ⤷ How do I calculate the required airflow for this heat sink based on my chip's TDP?
    • ⤷ What are the PCB hole requirements for the pushPIN attachment system?
    • ⤷ Can this heat sink be used with a custom thermal paste instead of the pre-applied T766?