The **ATS-20A-101-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** designed for cooling integrated circuits (ICs) and other electronic surface-mount devices. Below is a detailed breakdown of its electronic and physical specifications. --- ### 1. General Specifications This part is manufactured by **Advanced Thermal Solutions (ATS)** and belongs to the **maxiFLOW™** product line, known for its unique flared fin structure that maximizes air turbulence and heat dissipation. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-20A-101-C2-R0 | | **Material** | Aluminum (Extruded) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring (Brass) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout planning to ensure there is no mechanical interference with nearby capacitors or connectors. | Dimension | Value | | :--- | :--- | | **Length/Width** | 45mm x 45mm | | **Height** | 12.7mm | | **Weight** | ~25 grams | --- ### 3. Thermal Performance Thermal resistance is measured in **°C/W** (Degrees Celsius per Watt). A lower value indicates better cooling efficiency. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 LFM (1.0 m/s)** | 2.05 | | **400 LFM (2.0 m/s)** | 1.15 | | **600 LFM (3.0 m/s)** | 0.88 | --- ### 4. Technical Features & Design * **maxiFLOW™ Geometry:** The fins are flared outwards. This design reduces pressure drop and increases the surface area exposed to airflow, which is more efficient than standard straight-fin heat sinks. * **Push-Pin Mounting:** This provides a secure, vibration-resistant attachment to the PCB. It requires pre-drilled holes in the motherboard (typically 3.0mm diameter). * **C2 Material Grade:** The "C2" suffix typically refers to the specific Thermal Interface Material (TIM) and clip/pin configuration used for the assembly. * **Pre-applied TIM:** It comes with **T766** phase-change material already applied to the base, ensuring optimal thermal contact with the chip without the mess of manual thermal paste application. --- ### 5. Common Applications * **Processors (CPUs/GPUs):** Low-power embedded processors. * **FPGAs & ASICs:** High-speed signal processing chips that generate localized heat. * **Telecommunications:** Network switches and routers. * **Power Supplies:** Cooling MOSFETs or power regulators.