The **ATS-20A-151-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW" product line, designed specifically for cooling electronic components like processors, FPGAs, and ASICs where high-velocity airflow is present. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 3.93°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Fin Style** | Straight | | **Attachment Material** | Brass (Spring loaded) | --- ### 2. Design and Engineering Features * **maxiFLOW™ Design:** The heat sink features a tapered fin design that maximizes surface area for radiant cooling while minimizing pressure drop. This is ideal for high-density PCB layouts. * **pushPIN™ Attachment:** Instead of messy thermal adhesives or complex clips, this part uses a standardized push-pin system. This ensures consistent pressure across the interface for optimal heat transfer and allows for easy removal/rework. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** high-performance thermal phase change material to ensure a low-resistance path between the component and the sink. --- ### 3. Deciphering the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer Prefix (Advanced Thermal Solutions) | | **20A** | Product Series / pushPIN™ Version | | **151** | Specific Heat Sink Geometry/Profile | | **C2** | Thermal Performance Grade / Material Coating | | **R0** | RoHS Compliant / Revision Status | --- ### 4. Application Use Case This heat sink is primarily used in **telecommunications, networking, and industrial computing**. Because of its low profile (10mm height), it fits well in 1U rackmount servers or small-form-factor (SFF) devices where vertical space is limited but horizontal airflow is consistent.