The **ATS-20A-89-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "maxiFLOW™" series, designed for high-density electronic cooling. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Blue Anodized Aluminum | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | | **Thermal Resistance** | 1.83° C/W (@ 200 LFM) | | **Flow Pattern** | Directional (High-performance fin design) | --- ### 2. Key Electronic & Physical Design Elements #### A. Fin Geometry (maxiFLOW™) The "maxiFLOW" design features a flared fin structure. Unlike traditional straight-fin heat sinks, this geometry: * Reduces pressure drop. * Increases the surface area for heat dissipation. * Is optimized for constrained airflow environments common in server racks and telecommunications hardware. #### B. The pushPIN™ Attachment System The **-R0** suffix indicates the specific mounting kit. The pushPIN™ system includes: * **Brass/Plastic Pins:** Designed to fit into pre-drilled holes on the PCB. * **Compression Springs:** Provides precise, uniform pressure (Force) to ensure the interface between the heat sink and the electronic component (CPU, GPU, or ASIC) is tight and efficient. * **Reliability:** Unlike adhesive tapes, this mechanical attachment is resistant to vibration and thermal expansion cycling. #### C. Thermal Interface Material (TIM) Typically, these units come with a pre-applied **Phase Change Material (PCM)** or high-performance thermal pad on the base. This fills the microscopic air gaps between the component and the aluminum, drastically lowering the contact resistance. --- ### 3. Typical Applications This specific part is used for cooling high-heat-generating semiconductors, such as: * **FPGAs (Field Programmable Gate Arrays)** * **ASICs (Application-Specific Integrated Circuits)** * **Power Modules** * **Northbridge/Southbridge Chipsets** --- ### 4. Part Number Breakdown * **ATS:** Manufacturer (Advanced Thermal Solutions). * **20A:** Part series/Height profile indicator. * **89:** Specific footprint/model number. * **C2:** Material/Finish (typically Blue Anodized). * **R0:** Revision/Mounting kit type (standard pushPIN).