ATS-20B-03-C2-R0
AI

The **ATS-20B-03-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components like CPUs, GPUs, and power transistors.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 15.85°C/W (at 200 LFM) |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Heat Sink Type** | Top Mount (Cross-Cut) |
| **Thermal Interface (TIM)** | T766 (Pre-applied) |
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### 2. Physical Dimensions
Precision measurements are critical for PCB layout and clearance planning:
| Dimension | Value (mm) |
| :--- | :--- |
| **Length/Width** | 40.00 mm x 40.00 mm |
| **Height** | 10.00 mm |
| **Pin Pitch** | 33.00 mm |
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### 3. Key Electronic/Mechanical Features
* **Cross-Cut Fin Pattern:** The fins are cut in both directions. This design allows for multidirectional airflow, making it ideal for systems where the air direction might change or is turbulent.
* **Push-Pin Attachment:** The use of plastic push-pins and a brass/steel spring ensures consistent pressure on the electronic component, which optimizes heat transfer while preventing damage to the PCB.
* **Pre-applied TIM:** It comes with **T766 thermal interface material**, which eliminates the need for manual application of thermal paste during assembly, ensuring a reliable bond between the component and the heat sink.
* **Blue Anodized Coating:** The surface treatment is not just aesthetic; it increases the surface emissivity, which slightly improves radiative heat transfer and protects the aluminum from corrosion.
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### 4. Common Applications
* **Integrated Circuits (ICs):** Cooling FPGAs, ASICs, and high-speed processors.
* **Power Electronics:** Dissipating heat from MOSFETs and voltage regulators.
* **Telecommunications:** Used in routers and switches where airflow is provided by system fans.
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What are the alternative attachment methods for ATS heat sinks if push-pins are not suitable?
- ⤷ How does the T766 thermal interface material compare to high-performance thermal grease?
- ⤷ Can this heat sink be used in natural convection environments without a fan?