The **ATS-20B-07-C3-R0** is a high-performance electronic thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the physical and thermal characteristics of the product. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Push-Pin (Pin Fin) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 16.97°C/W @ 200 LFM | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Physical Design Features #### **Pin Fin Geometry** Unlike traditional "straight fin" heat sinks, the pin fin design consists of multiple vertical cylindrical or square pins. This structure: * Increases surface area for heat transfer. * Is "omni-directional," meaning it allows air to flow through the heat sink from any direction, making it ideal for systems with complex airflow. #### **Push-Pin Attachment** The "20B" series features a push-pin mounting mechanism. This provides: * **Constant Pressure:** The springs ensure a consistent load on the component, improving heat transfer efficiency. * **Ease of Assembly:** Quick installation through pre-drilled holes in the PCB without the need for specialized tools. #### **Blue Anodized Coating** The aluminum is blue-anodized. This is not just for aesthetics; it provides: * **Increased Emissivity:** Improves radiant heat transfer. * **Corrosion Resistance:** Protects the aluminum from environmental degradation. --- ### 3. Thermal Performance (Estimated) The efficiency of the ATS-20B-07-C3-R0 depends on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 16.97 | | 300 (1.5 m/s) | 11.80 | | 400 (2.0 m/s) | 10.30 | | 600 (3.0 m/s) | 8.60 | --- ### 4. Applications This part is typically used in: 1. **Telecommunications:** Cooling of ASICs and high-speed networking chips. 2. **Embedded Systems:** Industrial PCs where vertical space is limited (12.7mm height). 3. **Power Supplies:** Heat dissipation for voltage regulators or power modules. ---