The **ATS-20B-10-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their "blue ice" series of high-performance heat sinks. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 7.89°C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific nomenclature used by ATS to identify the product's attributes: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **20B**: The specific family/series of the heat sink. * **10**: Indicates the specific fin pattern or size configuration within the series. * **C2**: Refers to the thermal interface material (TIM) or specific coating (typically T766 or similar). * **R0**: Version/Revision code. --- ### 3. Key Features and Applications #### Design Features * **pushPIN™ Attachment:** This system uses a flexible, spring-loaded mechanism that ensures even pressure across the electronic component (like a CPU or FPGA), improving heat transfer. * **High Performance:** The fin geometry is designed for optimal airflow and heat dissipation in cramped electronic enclosures. * **Material:** The aluminum construction offers a balance of lightweight design and high thermal conductivity. #### Common Applications 1. **Telecommunications:** Used in routers and switches to cool high-speed processors. 2. **Embedded Systems:** Ideal for industrial PCs where active cooling (fans) might not be feasible. 3. **Power Electronics:** Cooling MOSFETs or power converters that generate significant localized heat. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 7.89 | | 200 (1.0 m/s) | 2.73 | | 400 (2.0 m/s) | 1.46 |