The **ATS-20B-129-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ HS | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W)** | 60.00mm x 60.00mm | | **Height** | 10.00mm (Low Profile) | | **Thermal Resistance** | 8.68°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Design and Construction The ATS-20B-129-C2-R0 utilizes a specialized design to maximize surface area while maintaining a small footprint: * **Fine Pitch Fins:** The "129" series features a specific fin density designed for optimized airflow. * **pushPIN™ Attachment:** Instead of messy adhesives or heavy brackets, it uses a spring-loaded push-pin mechanism. This ensures constant pressure (clamping force) on the component, which improves thermal transfer. * **TIM (Thermal Interface Material):** These units typically come with pre-applied **Phase Change Material** or thermal tape to ensure no air gaps exist between the chip and the aluminum base. --- ### 3. Thermal Performance Profile Thermal resistance is measured based on the airflow (Linear Feet per Minute - LFM). The lower the °C/W value, the more efficient the cooling. | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 8.68 | | 300 | 1.5 | 3.11 | | 500 | 2.5 | 2.25 | | 700 | 3.5 | 1.84 | --- ### 4. Common Applications Due to its low profile (10mm height) and 60mm width, this part is commonly used in: * **Networking Equipment:** Switches and routers where vertical space is limited. * **Embedded Systems:** Industrial PCs and Single Board Computers (SBCs). * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Telecom:** High-speed data transmission modules.