The **ATS-20B-147-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW" series, designed specifically to dissipate heat from electronic components like CPUs, GPUs, FPGAs, and power modules. --- ## 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific part: | Property | Value | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-20B-147-C2-R0 | | **Material** | Aluminum (with Blue Anodized finish) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 13.52°C/W (@ 1.0 m/s flow) | | **Fin Style** | maxiFLOW (Tapered Fin Design) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Features and Design ### A. maxiFLOW™ Fin Geometry The "B" in the part number indicates the maxiFLOW design. This features a unique tapered fin structure that increases the surface area for heat dissipation while maximizing air ingestion. It is particularly effective in environments with limited airflow. ### B. pushPIN™ Attachment Unlike simple adhesive tapes, the **pushPIN™** system ensures a secure, high-pressure mechanical connection to the PCB. * It uses a brass or plastic pin with a stainless steel spring. * The spring provides consistent pressure to optimize the performance of the Thermal Interface Material (TIM). ### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a high-performance phase-change material that fills microscopic air gaps between the electronic component and the heat sink base, significantly reducing thermal impedance. --- ## 3. Part Number Breakdown Understanding the nomenclature helps identify variations: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **20** | Attachment Style (pushPIN™) | | **B** | Fin Design (maxiFLOW) | | **147** | Specific dimension/configuration code | | **C2** | Color/Finish (Blue Anodized) | | **R0** | RoHS Compliant / Revision code | --- ## 4. Typical Applications This heat sink is commonly used in high-density electronics where space is at a premium: * **Networking:** Routers, switches, and base stations. * **Computing:** Embedded systems and industrial PCs. * **Power Supplies:** Cooling MOSFETs or voltage regulators.