The **ATS-20B-148-C2-R0** is a high-performance heat sink manufactured by Advanced Thermal Solutions, Inc. (ATS). It is part of the **maxiFLOW™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Base Dimensions** | 30.00mm x 30.00mm | | **Height** | 15.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 8.70°C/W (at 200 LFM) | | **Flow Direction** | Undirectional / Straight Fin | --- ### 2. Key Electronic & Mechanical Components The "electronic" utility of this part is defined by its ability to manage thermal energy generated by semiconductors. Here are the core components of the assembly: #### A. The Heat Sink Body (maxiFLOW™) * **Design:** Features a tapered fin design that increases the surface area for maximum heat dissipation. * **Performance:** It is specifically engineered for high-velocity airflow environments (convection cooling). #### B. Attachment System (pushPIN™) This is the hardware that secures the heat sink to the Printed Circuit Board (PCB). * **Brass Components:** The pins are often nickel-plated brass for durability. * **Compression Springs:** These ensure consistent pressure (load) on the electronic chip, which is critical for maximizing the efficiency of the Thermal Interface Material (TIM). #### C. Thermal Interface Material (TIM) * **Pre-applied Coating:** This part typically comes with a high-performance thermal pad or grease (often **T766**) pre-applied to the base. * **Purpose:** It fills microscopic air gaps between the heat sink and the electronic component to lower contact resistance. --- ### 3. Part Number Breakdown The nomenclature **ATS-20B-148-C2-R0** can be decoded as follows: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **20B** | Series/Designator for pushPIN™ assembly | | **148** | Specific dimension and fin configuration | | **C2** | Material/Finish (Blue Anodized Aluminum) | | **R0** | Revision or Packaging code | --- ### 4. Application Use Cases This component is typically mounted on: * **FPGAs (Field Programmable Gate Arrays):** Used in telecommunications. * **ASICs:** Custom integrated circuits that generate significant heat in a small 30mm footprint. * **Voltage Regulator Modules (VRMs):** Powering high-end server processors.