The part number **ATS-20B-153-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" attachment series designed for cooling electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 4.05 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied phase change material) | --- ### 2. Breakdown of the Part Number The alphanumeric string follows a specific naming convention used by ATS to identify the product's attributes: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **20**: Part series / Attachment style. * **B**: Material (usually denotes Aluminum). * **153**: Specific dimensions and fin configuration code. * **C2**: Color/Finish (Blue Anodized). * **R0**: RoHS compliance status. --- ### 3. Key Electronic Functions While a heat sink is a passive mechanical component, its role in an electronic system is critical for hardware longevity: 1. **Heat Dissipation**: It increases the surface area of the heat-generating component (the IC), allowing air to carry heat away more efficiently. 2. **Phase Change TIM**: The "T766" coating on the base melts at a specific operating temperature to fill microscopic air gaps between the chip and the heat sink, significantly reducing thermal impedance. 3. **Mechanical Security**: The brass push-pins and springs provide a specific amount of downward pressure (clamping force), ensuring consistent contact without cracking the delicate silicon die. --- ### 4. Application Use Cases * **BGA Cooling**: Ideal for Ball Grid Array (BGA) components that require active or passive airflow. * **Prototyping**: Commonly used on development boards (like Raspberry Pi or industrial SBCs) where standard mounting holes are present. * **Power Electronics**: Cooling voltage regulators or high-speed processors in telecommunications equipment. ---