ATS-20B-161-C2-R0
AI

The part number **ATS-20B-161-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, and other integrated circuits.
---
### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 4.74°C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 20mm |
| **Fin Style** | Straight Fin |
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### 2. Breakdown of the Part Number
The alphanumeric code follows a specific naming convention used by ATS to identify the product's features:
1. **ATS**: Manufacturer (Advanced Thermal Solutions).
2. **20B**: Series designation (Push-pin heat sink series).
3. **161**: Specific dimensions and internal geometry identifier.
4. **C2**: Material and Finish (Aluminum with Blue Anodized finish).
5. **R0**: Revision or specific packaging code.
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### 3. Key Electronic Functions
While the heat sink itself is passive (no moving parts), it plays a critical role in the reliability of electronic systems:
* **Heat Dissipation:** It increases the surface area of the component (e.g., a BGA chip), allowing air to carry away heat more efficiently.
* **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied high-performance thermal interface material to ensure no air gaps exist between the heat sink and the component.
* **Mechanical Stability:** The use of brass push-pins and springs ensures a consistent pressure (load) is applied to the chip, which is vital for maintaining thermal contact without cracking the silicon die.
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### 4. Implementation Example
In a typical PCB design, this part is used as follows:
```text
PCB Mounting Pattern:
[ (Hole) ---------------- (Hole) ]
| |
| [ IC CHIP ] | <-- Heat Sink (ATS-20B-161-C2-R0)
| | sits on top of the chip.
[ (Hole) ---------------- (Hole) ]
```
The push-pins snap into 3.0mm diameter holes pre-drilled into the PCB, securing the sink tightly against the electronic component.
- ⤷
What is the thermal resistance of this heat sink at different airflow speeds (LFM)?
- ⤷ Is there a version of this heat sink with a different attachment method like adhesive tape?
- ⤷ What is the recommended hole diameter for the push-pin mounting?