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  • ATS-20B-161-C2-R0

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    The part number **ATS-20B-161-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 4.74°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Fin Style** | Straight Fin | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific naming convention used by ATS to identify the product's features: 1. **ATS**: Manufacturer (Advanced Thermal Solutions). 2. **20B**: Series designation (Push-pin heat sink series). 3. **161**: Specific dimensions and internal geometry identifier. 4. **C2**: Material and Finish (Aluminum with Blue Anodized finish). 5. **R0**: Revision or specific packaging code. --- ### 3. Key Electronic Functions While the heat sink itself is passive (no moving parts), it plays a critical role in the reliability of electronic systems: * **Heat Dissipation:** It increases the surface area of the component (e.g., a BGA chip), allowing air to carry away heat more efficiently. * **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied high-performance thermal interface material to ensure no air gaps exist between the heat sink and the component. * **Mechanical Stability:** The use of brass push-pins and springs ensures a consistent pressure (load) is applied to the chip, which is vital for maintaining thermal contact without cracking the silicon die. --- ### 4. Implementation Example In a typical PCB design, this part is used as follows: ```text PCB Mounting Pattern: [ (Hole) ---------------- (Hole) ] | | | [ IC CHIP ] | <-- Heat Sink (ATS-20B-161-C2-R0) | | sits on top of the chip. [ (Hole) ---------------- (Hole) ] ``` The push-pins snap into 3.0mm diameter holes pre-drilled into the PCB, securing the sink tightly against the electronic component.
    ✨ Follow-up Questions
    • ⤷ What is the thermal resistance of this heat sink at different airflow speeds (LFM)?
    • ⤷ Is there a version of this heat sink with a different attachment method like adhesive tape?
    • ⤷ What is the recommended hole diameter for the push-pin mounting?