ATS-20B-191-C2-R0
AI

The **ATS-20B-191-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors.
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### 1. Technical Specifications
Below is the technical breakdown of the part based on its nomenclature:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Product Series** | pushPIN™ Heat Sink |
| **Attachment Type** | Push-Pin (Plastic or Brass) |
| **Thermal Resistance** | 2.90°C/W (Unducted Flow @ 100 LFM) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions** | 45mm x 45mm x 30mm |
| **Fin Pattern** | Fine Pitch (Cross-Cut) |
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### 2. Key Electronic Components
While the heatsink itself is mechanical, it integrates with electronic assemblies through the following features:
#### A. Thermal Interface Material (TIM)
The part typically comes with a pre-applied **T766** phase-change material or thermal tape. This fills the microscopic air gaps between the electronic component (die/package) and the heatsink base to ensure maximum heat transfer.
#### B. Push-Pin Mounting System
It utilizes a spring-loaded push-pin mechanism. In an electronic PCB layout, this requires:
* Two or four specific mounting holes drilled into the PCB.
* Calculated spring tension to provide consistent pressure without cracking the silicon die.
#### C. Fin Design (Heat Dissipation)
The "Cross-Cut" or "Straight Fin" geometry is optimized for air cooling. In a system, this part works in conjunction with a **DC Fan** or system airflow to lower the junction temperature ($T_j$) of the semiconductor.
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### 3. Application Use Cases
* **Integrated Circuits (ICs):** Cooling FPGAs, ASICs, or high-speed processors.
* **Power Electronics:** Dissipating heat from MOSFETs or IGBTs in power supply units.
* **Embedded Systems:** Industrial PCs where high-profile cooling is required within a limited footprint (45mm footprint).
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### 4. Dimensional Diagram (Approximate)
```text
45mm
|-----------|
| |
| [Fins] | 30mm (Height)
| |
|___________|
[Base]
```
- ⤷
What are the specific PCB hole diameters required for the ATS push-pin system?
- ⤷ How does the 'C2' designation in the part number affect its thermal properties?
- ⤷ What is the difference between ducted and unducted thermal resistance for this heatsink?