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  • ATS-20B-191-C2-R0

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    The **ATS-20B-191-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications Below is the technical breakdown of the part based on its nomenclature: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Product Series** | pushPIN™ Heat Sink | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 2.90°C/W (Unducted Flow @ 100 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 30mm | | **Fin Pattern** | Fine Pitch (Cross-Cut) | --- ### 2. Key Electronic Components While the heatsink itself is mechanical, it integrates with electronic assemblies through the following features: #### A. Thermal Interface Material (TIM) The part typically comes with a pre-applied **T766** phase-change material or thermal tape. This fills the microscopic air gaps between the electronic component (die/package) and the heatsink base to ensure maximum heat transfer. #### B. Push-Pin Mounting System It utilizes a spring-loaded push-pin mechanism. In an electronic PCB layout, this requires: * Two or four specific mounting holes drilled into the PCB. * Calculated spring tension to provide consistent pressure without cracking the silicon die. #### C. Fin Design (Heat Dissipation) The "Cross-Cut" or "Straight Fin" geometry is optimized for air cooling. In a system, this part works in conjunction with a **DC Fan** or system airflow to lower the junction temperature ($T_j$) of the semiconductor. --- ### 3. Application Use Cases * **Integrated Circuits (ICs):** Cooling FPGAs, ASICs, or high-speed processors. * **Power Electronics:** Dissipating heat from MOSFETs or IGBTs in power supply units. * **Embedded Systems:** Industrial PCs where high-profile cooling is required within a limited footprint (45mm footprint). --- ### 4. Dimensional Diagram (Approximate) ```text 45mm |-----------| | | | [Fins] | 30mm (Height) | | |___________| [Base] ```
    ✨ Follow-up Questions
    • ⤷ What are the specific PCB hole diameters required for the ATS push-pin system?
    • ⤷ How does the 'C2' designation in the part number affect its thermal properties?
    • ⤷ What is the difference between ducted and unducted thermal resistance for this heatsink?