The **ATS-20B-196-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Plastic Pins / Springs) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Thermal Resistance** | 18.11°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Features #### A. Fin Profile: Straight Fin This model uses a **straight fin** design. Straight fins are ideal for applications where there is a consistent, directed airflow. They provide a high surface-area-to-volume ratio, allowing for efficient heat transfer in forced-air environments. #### B. pushPIN™ Attachment Unlike adhesive tapes or simple clips, the **pushPIN™** system uses a flexible mechanism: * **Compression Springs:** Ensure even pressure across the component surface for maximum thermal contact. * **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a high-performance phase-change or grease-like material that fills the microscopic air gaps between the heat sink base and the electronic chip, significantly lowering thermal resistance. --- ### 3. Application Use Cases The ATS-20B-196-C2-R0 is typically used in the following electronic sectors: 1. **Telecommunications:** For cooling line cards and high-speed switches. 2. **Embedded Systems:** Protecting SoCs (System on Chips) in industrial computers. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Thermal Performance Data Performance varies based on Airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 18.11 | | 300 (1.5 m/s) | 8.22 | | 500 (2.5 m/s) | 6.35 | | 700 (3.5 m/s) | 5.48 |