The **ATS-20B-20-C2-R0** is a specific electronic component belonging to the thermal management category. It is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" series. --- ## 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown of the technical data: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 25mm | | **Thermal Resistance** | 7.14°C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | --- ## 2. Key Component Features ### A. pushPIN™ Attachment Mechanism Unlike traditional adhesive-based heat sinks, this part uses a mechanical fastening system consisting of: * **Brass/Plastic Pins:** Used to secure the sink to the PCB. * **Compression Springs:** Provide precise, consistent pressure (preload) on the electronic component (CPU, GPU, or FPGA), ensuring maximum heat transfer. ### B. Thermal Interface Material (TIM) The "R0" suffix generally indicates the inclusion of a pre-applied **Thermal Interface Material**. Specifically, this model typically features **T766**, which is a high-performance thermal pad/grease that fills microscopic air gaps between the component and the heat sink. ### C. Fin Profile The heat sink utilizes a **Square-Fin** or **Cross-Cut** design. This pattern allows for multi-directional airflow, making it highly effective in systems where the direction of the cooling fan's exhaust might vary or be turbulent. --- ## 3. Physical Dimensions (Metric) | Dimension | Value (mm) | | :--- | :--- | | **Length (A)** | 45.00 | | **Width (B)** | 45.00 | | **Height (C)** | 25.00 | | **Pitch (E)** | 38.00 | | **Pitch (F)** | 38.00 | --- ## 4. Typical Applications This electronic part is designed for cooling surface-mount components that generate significant heat: * **Networking Hardware:** Switches and routers. * **Embedded Systems:** High-speed processors. * **Power Electronics:** Transistors and power modules. * **Industrial Controls:** Boards requiring high vibration resistance (due to the secure pin attachment).