The **ATS-20B-202-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series, designed for cooling electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-20B-202-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 15mm | | **Attachment Method** | Push Pin (Plastic) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific naming convention used by ATS to identify the physical and thermal properties of the unit: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **20B**: Series designation (likely refers to the pin-fin or specific fin pattern). * **202**: Geometric code for the dimensions (45mm x 45mm). * **C2**: Refers to the thermal performance/fin density or specific kit variation. * **R0**: Version/Revision number (Standard ROHS compliant). --- ### 3. Key Electronic Cooling Features #### A. Pin-Fin Geometry Unlike traditional straight-fin heat sinks, this model uses a **pin-fin** design. This allows for multi-directional airflow, making it highly effective in systems where the direction of the cooling fan's exhaust might vary or where air turbulence is high. #### B. Thermal Interface Material (TIM) The "T766" coating is a high-performance thermal grease or pad applied to the base. Its job is to fill the microscopic air gaps between the electronic component (heat source) and the aluminum base, ensuring maximum heat transfer. #### C. Push-Pin Attachment This part uses a mechanical push-pin system with a spring. * **Reliability:** It provides consistent pressure (load) on the component. * **Safety:** It prevents the heat sink from shifting during shipping or vibration, which is a risk with simple "peel-and-stick" adhesives. --- ### 4. Application Use Cases * **Embedded Systems:** Cooling SoCs (System on Chips). * **Networking:** Routers, switches, and high-speed modems. * **Industrial PC:** Ruggedized computers requiring passive or active airflow cooling. * **Power Supplies:** Cooling MOSFETs or power regulators. ---