### Electronic Component Overview: ATS-20B-207-C2-R0 The **ATS-20B-207-C2-R0** is a high-performance **Heat Sink** assembly designed by Advanced Thermal Solutions (ATS). It is specifically engineered for cooling electronic components such as CPUs, GPUs, FPGAs, and high-power transistors. --- ### 1. Technical Specifications The following table highlights the critical mechanical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 6.39°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 10.00mm | | **Fin Style** | Straight Fin | --- ### 2. Key Design Features * **pushPIN™ Attachment:** This model uses a spring-loaded push-pin mechanism. This ensures a consistent pressure (Force) against the electronic component, which optimizes the thermal interface material (TIM) performance. * **Low Profile:** With a height of only 10mm, it is designed for space-constrained applications like 1U servers or compact embedded systems. * **Thermal Performance:** The straight-fin design is optimized for **forced-air cooling** (airflow from a fan). The aluminum construction provides high thermal conductivity while remaining lightweight. * **Pre-Applied TIM:** These units typically come with a pre-applied high-performance Thermal Interface Material to simplify the assembly process. --- ### 3. Application Use Cases This component is typically mounted on integrated circuits (ICs) that generate significant heat during operation. Common applications include: 1. **Network Switches/Routers:** Cooling the primary processing ASIC. 2. **Power Electronics:** Managing heat for MOSFET arrays or IGBTs. 3. **Embedded Computing:** Providing heat dissipation for SoCs (System on Chips). --- ### 4. Thermal Resistance Reference Thermal performance varies based on the airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 6.39 | | 300 | 1.5 | 2.86 | | 500 | 2.5 | 2.09 | | 700 | 3.5 | 1.73 |