The **ATS-20B-210-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series, specifically designed for cooling electronic components like CPUs, GPUs, and FPGAs. Below is the breakdown of its technical specifications and electronic characteristics. ### 1. Technical Specifications This part is a "push-pin" style heat sink, which ensures a secure attachment to the PCB while providing consistent pressure for thermal interface materials. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 54.00mm x 54.00mm x 25.00mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | ~5.18°C/W (Unducted @ 200 LFM) | | **Fin Style** | Straight Fin | | **RoHS Status** | Compliant | --- ### 2. Cooling Performance The "Electronic" part of this component is its ability to dissipate heat generated by semiconductors. The thermal resistance determines how effectively it keeps a chip below its maximum operating temperature. * **Low Airflow (200 LFM):** 5.18 °C/W * **High Airflow (700 LFM):** 1.90 °C/W As airflow (Linear Feet per Minute) increases, the thermal resistance drops significantly, allowing the electronic component to run cooler and more reliably. --- ### 3. Component Breakdown (Nomenclature) The part number itself describes the physical and thermal properties: 1. **ATS**: Advanced Thermal Solutions (Manufacturer). 2. **20B**: Series designation. 3. **210**: Specific size/geometry code (54mm x 54mm). 4. **C2**: Material/Color code (typically Blue Anodized). 5. **R0**: Revision or specific packaging code. ### 4. Application in Electronics This heat sink is typically found in: * **Networking Equipment:** Routers and switches where high-speed processors generate significant heat. * **Industrial PCs:** Providing passive or active cooling in harsh environments. * **Power Supplies:** Cooling MOSFETs or power transistors. --- ### 5. Installation Note For optimal performance, this part requires a **Thermal Interface Material (TIM)**, such as thermal grease or a phase-change pad, to be placed between the electronic chip and the aluminum base of the heat sink to fill microscopic air gaps.