## Overview of ATS-20B-23-C2-R0 The **ATS-20B-23-C2-R0** is a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **maxiFLOW™** series, which is specifically designed to provide low thermal resistance and high reliability for cooling electronic components such as CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-20B-23-C2-R0 | | **Type** | Board Level Heat Sink | | **Material** | Aluminum (Body), Copper (Internal slug/base) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 12.01°C/W @ (Natural Convection) | | **Dimensions** | 46.90mm x 46.90mm x 15.00mm | --- ### 2. Electronic Application & Functionality In an electronic circuit, the ATS-20B-23-C2-R0 serves as a **Passive Cooling Component**. Its primary purpose is to dissipate heat generated by active semiconductors into the surrounding air. #### Key Electronic Benefits: * **Thermal Management:** Prevents thermal throttling in processors by maintaining a safe operating temperature. * **Blue Anodized Finish:** While primarily for aesthetics and corrosion resistance, the anodized surface provides a thin layer of electrical insulation, reducing the risk of accidental short circuits if the sink touches nearby components. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance thermal grease that fills microscopic air gaps between the chip and the heat sink base. --- ### 3. Attachment Mechanism: pushPIN™ The electronic integration relies on the **pushPIN™** assembly system. This is crucial for PCB (Printed Circuit Board) design because: 1. **Standardized Holes:** It requires specific hole diameters on the PCB (typically 3.175mm). 2. **Compression Springs:** It ensures precise and consistent pressure on the electronic package, preventing damage to the chip while maximizing heat transfer. 3. **Stability:** It provides high vibration resistance, making it suitable for industrial or telecommunications hardware. --- ### 4. Thermal Performance Data | Air Flow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 12.01 | | 200 | 1.0 | 8.34 | | 300 | 1.5 | 6.77 | | 400 | 2.0 | 5.97 | ---