### Overview: ATS-20B-24-C2-R0 The **ATS-20B-24-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient thermal management of electronic components such as CPUs, GPUs, and other integrated circuits. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-20B-24-C2-R0 | | **Material** | Aluminum | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 23.62 °C/W (Unducted) | | **Dimensions (L x W x H)** | 60.00mm x 60.00mm x 20.00mm | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Components & Features #### 1. Heat Sink Design * **Fin Style:** The "B" in the part number indicates a specific fin geometry (usually straight or slanted depending on the sub-series) optimized for high surface area. * **Material:** Made from high-grade aluminum, which offers a balance of lightweight construction and high thermal conductivity. * **Finish:** The **Blue Anodized** coating protects against corrosion and improves thermal radiation properties. #### 2. The pushPIN™ Attachment System This part features a specialized mechanical mounting system: * **Spring-loaded Bolts:** Provides consistent pressure on the component, ensuring maximum contact with the die. * **Ease of Install:** Designed for tool-free or rapid assembly on PCBs using pre-drilled holes. #### 3. Thermal Interface Material (TIM) * **T766:** This part comes with a pre-applied phase-change material or high-performance grease. This fills microscopic gaps between the heat sink and the electronic chip to minimize thermal resistance. --- ### Thermal Performance Data Performance varies based on airflow (Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 23.62 | | 200 (1.0 m/s) | 10.98 | | 300 (1.5 m/s) | 6.36 | | 400 (2.0 m/s) | 4.44 | --- ### Common Applications * **Embedded Systems:** Cools processors in industrial computers. * **Networking Hardware:** Used on switches and routers for ASICs. * **Power Electronics:** Dissipates heat from MOSFETs or voltage regulators.