## ATS-20B-30-C2-R0: Electronic Component Specifications The **ATS-20B-30-C2-R0** is a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their **maxiFLOW™** series, designed specifically for cooling electronic components such as CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Key Technical Specifications | Parameter | Specification | Description | | :--- | :--- | :--- | | **Component Type** | Heat Sink | Passive thermal management device. | | **Material** | Aluminum | Lightweight with high thermal conductivity. | | **Dimensions** | 57.6mm x 57.6mm | Base size (Large footprint for high-heat components). | | **Height** | 14.5mm | Low-profile design suitable for restricted spaces. | | **Attachment Method** | maxiGRIP™ | Uses a plastic frame clip and a stainless steel "steady" spring. | | **Thermal Interface Material** | T766 | Pre-applied phase-change material for optimal heat transfer. | | **Finish** | Blue Anodized | Increases surface emissivity and provides corrosion resistance. | --- ### 2. Design and Engineering Features * **maxiFLOW™ Fin Geometry:** The fins are designed with a tapered, high-aspect-ratio geometry. This shape maximizes surface area while minimizing pressure drop, allowing air to flow through more efficiently compared to standard square-fin heat sinks. * **maxiGRIP™ Attachment:** * **Tool-less Installation:** The system uses a specialized frame clip that snaps onto the component. * **Mechanical Integrity:** It provides consistent pressure across the interface without requiring holes in the PCB, reducing the risk of board warping. * **T766 Phase Change Material:** This material is solid at room temperature but softens at operating temperatures to fill microscopic air gaps between the chip and the heat sink, significantly lowering thermal resistance. --- ### 3. Thermal Performance Indicators Thermal performance is measured in **Thermal Resistance (°C/W)**. A lower value indicates better cooling. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 LFM (1.0 m/s)** | 2.00 °C/W | | **300 LFM (1.5 m/s)** | 1.60 °C/W | | **400 LFM (2.0 m/s)** | 1.40 °C/W | | **500 LFM (2.5 m/s)** | 1.30 °C/W | --- ### 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer). * **20B:** Series identifier (maxiFLOW™ with maxiGRIP™). * **30:** Specific dimension/geometry code. * **C2:** Blue Anodized finish. * **R0:** Revision/Standard packaging code.