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  • ATS-20B-31-C2-R0

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    ### Electronic Part Overview: ATS-20B-31-C2-R0 The **ATS-20B-31-C2-R0** is a high-performance **Heat Sink** assembly designed by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, specifically engineered for cooling electronic components like CPUs, GPUs, and FPGAs where airflow is restricted. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 5.39 °C/W (@ 100 LFM) | | **Dimensions (L x W x H)** | 47.24mm x 57.00mm x 20.00mm | | **Flow Direction** | Straight Fin | | **RoHS Status** | Compliant | --- ### 2. Component Design & Features #### A. The maxiFLOW™ Geometry The "31" in the part number refers to a specific fin pattern. The maxiFLOW design features a **graduated fin profile**, which reduces pressure drop and increases the surface area exposed to airflow. This is critical for systems with high-density component layouts. #### B. pushPIN™ Attachment System Instead of simple adhesive tapes, this part uses a mechanical **pushPIN™** system: - **Spring-Loaded:** Ensures consistent pressure (interface force) for maximum heat transfer. - **Secure Mounting:** The "B" in the part number indicates a specific brass or plastic pin type designed for pre-drilled PCB holes. - **Reliability:** Protects the component from shifting during vibration or shipping. #### C. Thermal Interface Material (TIM) The "R0" suffix generally indicates that the heat sink comes pre-applied with a high-performance **Thermal Interface Material**. This eliminates the need for manual application of thermal grease during assembly. --- ### 3. Application Use Cases This specific heat sink is typically found in: * **Networking Equipment:** Routers and switches with high-speed processors. * **Embedded Systems:** Industrial PCs where vertical clearance is limited (20mm height). * **Power Supplies:** Cooling MOSFETs or power modules. --- ### 4. Decoding the Part Number | Code Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **20B** | Series/Mounting Style (pushPIN attachment) | | **31** | Specific Fin Geometry and Dimensions | | **C2** | Blue Anodized Finish (Thermal performance enhancement) | | **R0** | Pre-applied Thermal Interface Material (TIM) | ---
    ✨ Follow-up Questions
    • ⤷ What are the specific hole patterns required on a PCB for the pushPIN™ attachment?
    • ⤷ How does the thermal resistance change as airflow (LFM) increases for this model?
    • ⤷ Is this heat sink compatible with standard 40mm or 50mm fans?