ATS-20B-31-C2-R0
AI

### Electronic Part Overview: ATS-20B-31-C2-R0
The **ATS-20B-31-C2-R0** is a high-performance **Heat Sink** assembly designed by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, specifically engineered for cooling electronic components like CPUs, GPUs, and FPGAs where airflow is restricted.
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### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | pushPIN™ |
| **Thermal Resistance** | 5.39 °C/W (@ 100 LFM) |
| **Dimensions (L x W x H)** | 47.24mm x 57.00mm x 20.00mm |
| **Flow Direction** | Straight Fin |
| **RoHS Status** | Compliant |
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### 2. Component Design & Features
#### A. The maxiFLOW™ Geometry
The "31" in the part number refers to a specific fin pattern. The maxiFLOW design features a **graduated fin profile**, which reduces pressure drop and increases the surface area exposed to airflow. This is critical for systems with high-density component layouts.
#### B. pushPIN™ Attachment System
Instead of simple adhesive tapes, this part uses a mechanical **pushPIN™** system:
- **Spring-Loaded:** Ensures consistent pressure (interface force) for maximum heat transfer.
- **Secure Mounting:** The "B" in the part number indicates a specific brass or plastic pin type designed for pre-drilled PCB holes.
- **Reliability:** Protects the component from shifting during vibration or shipping.
#### C. Thermal Interface Material (TIM)
The "R0" suffix generally indicates that the heat sink comes pre-applied with a high-performance **Thermal Interface Material**. This eliminates the need for manual application of thermal grease during assembly.
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### 3. Application Use Cases
This specific heat sink is typically found in:
* **Networking Equipment:** Routers and switches with high-speed processors.
* **Embedded Systems:** Industrial PCs where vertical clearance is limited (20mm height).
* **Power Supplies:** Cooling MOSFETs or power modules.
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### 4. Decoding the Part Number
| Code Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Brand) |
| **20B** | Series/Mounting Style (pushPIN attachment) |
| **31** | Specific Fin Geometry and Dimensions |
| **C2** | Blue Anodized Finish (Thermal performance enhancement) |
| **R0** | Pre-applied Thermal Interface Material (TIM) |
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- ⤷
What are the specific hole patterns required on a PCB for the pushPIN™ attachment?
- ⤷ How does the thermal resistance change as airflow (LFM) increases for this model?
- ⤷ Is this heat sink compatible with standard 40mm or 50mm fans?