The **ATS-20B-32-C2-R0** is a specific electronic component primarily classified as a **High-Performance Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* as part of their "push-pin" attachment line. Below is the detailed technical breakdown of this part. --- ### 1. General Specifications This component is designed to dissipate heat from surface-mount devices (SMDs) like CPUs, GPUs, or FPGAs. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Series** | pushPIN™ Heat Sink Assembly | | **Attachment Type** | Push-Pin (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 24.95°C/W (at 100 LFM) | --- ### 2. Mechanical Dimensions Precision sizing is critical for ensuring the heat sink fits within the allocated PCB real estate. * **Length:** 38.00 mm * **Width:** 38.00 mm * **Height:** 15.00 mm * **Pitch (Hole spacing):** 43.00 mm --- ### 3. Electronic & Thermal Performance The "C2" and "R0" designations refer to the material grade and compliance standards. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** phase-change material, which enhances the heat transfer between the electronic chip and the aluminum fins. * **Airflow Efficiency:** The fin design is optimized for straight-line airflow. As airflow speed (LFM - Linear Feet per Minute) increases, the thermal resistance drops significantly: * **200 LFM:** 9.17 °C/W * **400 LFM:** 5.02 °C/W * **600 LFM:** 3.75 °C/W --- ### 4. Component Material Composition | Part | Material | Purpose | | :--- | :--- | :--- | | **Heat Sink** | Aluminum 6063 | High thermal conductivity and lightweight. | | **Push-Pin** | Nylon or Brass | Secure attachment to the PCB. | | **Spring** | Stainless Steel | Provides consistent pressure (TIM compression). | --- ### 5. Application Usage This part is commonly found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial motherboards. 3. **Power Supplies:** Cooling MOSFETs or power regulators.