The **ATS-20B-33-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 17.78mm | | **Thermal Resistance** | 17.42°C/W (Unducted @ 100 LFM) | | **Fin Type** | High-efficiency cross-cut design | --- ### 2. Key Features and Components #### A. pushPIN™ Attachment System The "20B" and "R0" designations often refer to the specific mounting hardware. This part uses a **push-pin and spring mechanism** which provides: * **Uniform Pressure:** Ensures consistent contact between the heatsink base and the heat source. * **Tool-less Installation:** Allows for quick assembly on PCBs with pre-drilled holes. #### B. Thermal Interface Material (TIM) The "C2" in the part number typically indicates that the heatsink comes pre-applied with **ATS-PPS-02** thermal grease. This improves heat transfer by filling microscopic air gaps between the component surface and the aluminum base. #### C. Cross-Cut Fin Design Unlike straight-fin heatsinks, the fins are notched. This creates turbulence in the airflow, which breaks up the boundary layer and significantly improves cooling efficiency in both forced-air and natural convection environments. --- ### 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **20B** | Series/Mounting Style (pushPIN Type) | | **33** | Dimension Reference (Base Size) | | **C2** | Thermal Interface Material (Pre-applied grease) | | **R0** | RoHS Compliant / Revision code | --- ### 4. Applications * **Networking Gear:** Routers, switches, and high-speed modems. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Cooling MOSFETs or Voltage Regulator Modules (VRMs).