Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-20B-34-C2-R0

  • AI
    The **ATS-20B-34-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of their "maxiFLOW™" series, designed for cooling electronic components like BGA (Ball Grid Array) chips. --- ### 1. Technical Specifications The part number provides details about the dimensions, material, and thermal performance. | Parameter | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W)** | 36.83 mm x 36.83 mm | | **Height** | 22.86 mm | | **Thermal Resistance** | 3.81° C/W (@ 200 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Key Electronic Features #### A. Thermal Management The primary electronic role of this part is to dissipate heat generated by integrated circuits (ICs). In modern electronics, excessive heat leads to "thermal throttling" or component failure. The **3.81° C/W** rating means that for every watt of power the chip consumes, its temperature will rise 3.81 degrees Celsius above the ambient air (assuming moderate airflow). #### B. The maxiFLOW™ Design The "34" in the part number refers to the specific fin pattern. The fins are tapered and spread out to increase surface area while minimizing pressure drop. This is critical for high-density PCBs where airflow might be obstructed by other components. #### C. pushPIN™ Attachment Unlike adhesive-only heat sinks, the **R0** designation indicates a push-pin mounting system. - **Benefits:** It provides consistent pressure across the chip surface, improving thermal transfer. - **Reliability:** It prevents the heat sink from shifting during mechanical shock or vibration, which is a common failure point in industrial or automotive electronics. --- ### 3. Application Use Cases This specific heat sink is commonly found in the following electronic systems: * **Networking Equipment:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and automation controllers. * **Telecommunications:** High-speed data processing units. --- ### 4. Part Number Breakdown ```text ATS - 20 - B - 34 - C2 - R0 | | | | | | | | | | | └── Revision/Attachment Code | | | | └─────── Color/Finish (C2 = Blue Anodized) | | | └──────────── Fin Pattern (maxiFLOW™) | | └──────────────── Width/Length Category | └───────────────────── Series Number └────────────────────────── Manufacturer (Advanced Thermal Solutions) ```
    ✨ Follow-up Questions
    • ⤷ What is the significance of the 'C2' blue anodized finish for thermal performance?
    • ⤷ How do I choose between a push-pin mount and a clip-on mount for this heat sink?
    • ⤷ What are the recommended airflow (LFM) conditions for this specific model?