The part number **ATS-20B-35-C2-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. This specific component belongs to the "maxiFLOW™" series, designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Series** | maxiFLOW™ | | **Material** | Aluminum (Anodized Blue) | | **Thermal Resistance** | 4.42 °C/W (Unducted Flow) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 17.78mm | | **Attachment Method** | pushPIN™ (Brass/Plastic pins) | | **Interface Material** | T766 (Thermal Tape/Grease included) | --- ## 2. Part Number Breakdown Understanding the nomenclature helps in identifying the specific configuration: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **20B**: The physical profile and fin pattern of the heatsink. * **35**: Represents the length/width (roughly 35mm-37mm square). * **C2**: Color and finish (Blue Anodized). * **R0**: Revision or packaging code. --- ## 3. Key Design Features ### maxiFLOW™ Fin Geometry The heatsink features a unique spread-fin design. Unlike standard square fins, these fins are angled outward to maximize surface area and increase airflow turbulence, which significantly improves heat dissipation in low-airflow environments. ### pushPIN™ Attachment This model uses a **pushPIN™** system rather than simple adhesive. * **Reliability:** It ensures a constant pressure (preload) against the component for optimal thermal contact. * **Hardware:** It typically includes a stainless steel spring and a brass or plastic pin that snaps into pre-drilled holes on the PCB. ### Thermal Interface Material (TIM) The part comes pre-applied with **T766**, a high-performance thermal interface. This eliminates the need for manual thermal paste application and ensures a consistent bond between the chip and the aluminum base. --- ## 4. Application Areas * **Networking:** Cooling for high-speed routers and switches. * **Embedded Systems:** For industrial PCs where space is limited but heat generation is high. * **Power Supplies:** Heat management for voltage regulators and MOSFETs.