The **ATS-20B-36-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed for cooling electronic components such as CPUs, GPUs, or high-power transistors on a PCB. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface (TIM)** | T766 (High Performance) | | **Dimensions** | 36.83mm x 36.83mm | | **Height** | 22.86mm | | **Thermal Resistance** | 1.48 °C/W (at 200 LFM) | --- ### 2. Key Electronic & Mechanical Components #### A. Fin Geometry (High-Density) This heatsink uses a **straight-fin** or **cross-cut** design (depending on the specific series iteration). The layout is optimized to maximize surface area for heat dissipation while maintaining a low pressure drop for airflow from system fans. #### B. Push-Pin Attachment System Instead of using adhesive or solder, this part uses a mechanical push-pin system: * **Drilled Holes:** Requires specific hole diameters on the PCB. * **Compression Springs:** Provides consistent pressure across the electronic component, ensuring maximum contact with the thermal interface material without cracking the silicon die. #### C. Thermal Interface Material (TIM) The "C2" suffix typically indicates that the part comes pre-applied with **T766 thermal phase-change material**. This eliminates the need for manual thermal paste application and ensures uniform heat transfer from the electronic chip to the aluminum base. --- ### 3. Application Use Cases This part is commonly found in: * **Telecommunications:** Cooling network switches and routers. * **Industrial PC (IPC):** Thermal management for embedded processors. * **Power Supplies:** Heat dissipation for MOSFETs and power ICs. --- ### 4. Thermal Performance Table *Performance varies based on Airflow (Measured in Linear Feet per Minute - LFM):* | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 1.48 | | 400 (2.0 m/s) | 1.05 | | 600 (3.0 m/s) | 0.85 |