The **ATS-20B-38-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed to provide high cooling efficiency in environments with restricted airflow. --- ### 1. Technical Specifications The part number encodes specific physical and material properties. Below are the primary specifications: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Base Dimensions** | 36.83 mm x 36.83 mm | | **Height** | 17.78 mm | | **Thermal Resistance** | 2.50 °C/W (@ 200 LFM) | | **Configuration** | Square, high-density fins | --- ### 2. Design Features The ATS-20B-38-C2-R0 is engineered with several electronic and mechanical considerations: * **maxiFLOW™ Fin Geometry:** The fins are designed with a tapered, high-density pattern. This maximizes the surface area for heat dissipation while minimizing pressure drop as air passes through. * **pushPIN™ Attachment:** This model uses a plastic or brass pin combined with a compression spring. This ensures: 1. **Uniform Pressure:** Prevents damage to the silicon die or PCB. 2. **Reliability:** Maintains a consistent interface with the thermal interface material (TIM) under vibration. * **Thermal Interface Material (TIM):** Typically, this specific part comes pre-applied with **ATS-PPS-07** (a high-performance thermal pad/grease) to ensure low contact resistance between the electronic chip and the heat sink. --- ### 3. Application Use Cases This part is typically used to cool high-heat electronic components such as: * **FPGAs & ASICs:** High-speed processing units found in networking gear. * **Microprocessors:** CPU/GPU components in embedded systems. * **Power Electronics:** Voltage regulators and motor drivers that generate significant heat. --- ### 4. Thermal Performance Comparison Thermal resistance ($R_{th}$) determines how well the part moves heat away from the electronics. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 1.0 m/s (200 LFM) | 2.50 | | 2.0 m/s (400 LFM) | 1.80 | | 3.0 m/s (600 LFM) | 1.50 | ---