The **ATS-20B-41-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. It belongs to the *maxiFLOW™* series manufactured by Advanced Thermal Solutions (ATS). --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (High Thermal Conductivity) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 20.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | ~10.07 °C/W (Unducted @ 200 LFM) | | **Flow Pattern** | maxiFLOW™ (Cross-cut for omnidirectional airflow) | --- ### 2. Key Electronic Components & Features #### A. The pushPIN™ Attachment System This part features a specialized mounting mechanism. Unlike adhesive-based heatsinks, the **pushPIN™** system uses: * **Compression Springs:** Provide precise vertical pressure (Force) to ensure optimal interface between the heatsink and the chip. * **Plastic/Brass Pins:** Secure the heatsink through pre-drilled holes in the Printed Circuit Board (PCB). #### B. Thermal Interface Material (TIM) The "R0" suffix usually indicates the inclusion of a pre-applied **Thermal Interface Material**. * **Role:** It fills microscopic air gaps between the component surface (CPU/GPU/ASIC) and the aluminum base to lower thermal resistance. * **Material:** Usually a phase-change material or high-performance thermal pad. #### C. Fin Geometry (maxiFLOW™) The electronic design of the fins is "tapered." This maximizes the surface area while minimizing the pressure drop. In high-density electronic enclosures, this geometry allows the heat to dissipate effectively even with low-speed cooling fans. --- ### 3. Typical Applications This specific heatsink is commonly found in: 1. **Telecommunications:** Cooling high-speed processors in routers and switches. 2. **Embedded Systems:** Industrial PCs where mechanical stability (vibration resistance) is required. 3. **Power Electronics:** Dissipating heat from MOSFETs or large voltage regulators. --- ### 4. Part Number Breakdown ```text ATS - 20 B - 41 - C3 - R0 | | | | | | | | | | | └── Thermal Interface/Color Code | | | | └─────── Attachment Type (pushPIN) | | | └──────────── Fin Pitch/Height Variant | | └───────────────── Series (maxiFLOW) | └─────────────────── Thermal Resistance Category └───────────────────────── Manufacturer (Advanced Thermal Solutions) ```