The **ATS-20B-55-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from surface-mount components like BGA (Ball Grid Array) chips. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-20B-55-C2-R0 | | **Heat Sink Type** | Push-pin style (Straight Fin) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Attachment Method** | Push-pin with Brass Springs | | **Thermal Resistance** | 23.98 °C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the physical and thermal characteristics: * **ATS-20**: Series identifier (typically refers to the push-pin attachment series). * **B**: Material/Color code (typically Blue Anodized Aluminum). * **55**: Specific geometry/footprint identifier. * **C2**: Heat sink height and pin material/strength indicator. * **R0**: RoHS compliance status. --- ### 3. Key Features * **High Efficiency Fins:** Uses a straight-fin design which is ideal for systems with high-velocity airflow (high LFM). * **Push-Pin Attachment:** The mechanism utilizes pre-drilled holes in the PCB. The push-pins have a flexible barb that locks into the board, ensuring a constant pressure on the chip. * **Thermal Interface Material (TIM):** This specific model comes with **T766** pre-applied. This is a high-performance phase-change material that fills microscopic air gaps between the chip and the heat sink. * **Spring-Loaded:** The brass springs provide a specific "sink-to-chip" force, preventing the heat sink from shifting during vibration or mechanical shock. --- ### 4. Application Use Cases This part is commonly found in the following electronic systems: 1. **Networking Hardware:** Switches, routers, and high-speed modems. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Supplies:** Cooling small MOSFET arrays or power ICs. 4. **FPGA/CPU Cooling:** Small-form factor processors that require reliable, long-term cooling.