The **ATS-20B-71-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 30mm | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 6.70° C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ### 2. Key Components & Features #### A. The Fin Design (Straight Fin) The heat sink utilizes a straight fin geometry. This design is optimized for **undirected airflow**, allowing the air to move through the fins with minimal pressure drop. This is ideal for systems where the cooling fan is not directly mounted on the heat sink. #### B. Attachment Mechanism (Push-Pin) Instead of adhesive tapes, this model uses a **spring-loaded push-pin** system. * **Security:** Provides consistent pressure on the processor. * **Reliability:** Resistant to shocks and vibrations. * **Ease of Use:** Pre-assembled pins reduce installation time on the PCB. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a "phase-change" material that fills the microscopic gaps between the heat sink and the electronic component, ensuring maximum heat transfer efficiency. --- ### 3. Electronic Application This part is typically used in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed network processors. 2. **Embedded Systems:** Industrial PCs where mechanical stability is required. 3. **Power Electronics:** Dissipating heat from VRMs (Voltage Regulator Modules) or power MOSFETs. ### 4. Code Representation (Thermal Simulation Input) If you were modeling this part in a thermal simulation script (like Python or MATLAB), the parameters would look like this: ```python # Thermal properties for ATS-20B-71-C2-R0 heat_sink_data = { "part_number": "ATS-20B-71-C2-R0", "material": "Aluminum 6063-T5", "thermal_conductivity_W_mK": 209, "dimensions_mm": {"length": 45, "width": 45, "height": 30}, "mounting": "Push-Pin", "surface_finish": "Blue Anodized" } ```