ATS-20B-77-C2-R0
AI

The **ATS-20B-77-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the "maxiFLOW" product line, designed to optimize airflow and heat dissipation for electronic components.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Base Dimensions** | 25mm x 25mm |
| **Height** | 30mm |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Resistance** | 9.30°C/W (Unducted flow) |
| **Pressure Drop** | 0.15 inH2O @ 200 LFM |
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### 2. Design and Component Breakdown
#### A. The Fin Geometry (maxiFLOW™)
Unlike traditional straight-fin heat sinks, the ATS-20B-77-C2-R0 uses a **tapered fin design**. This increases the surface area while reducing pressure drop, allowing air to flow more easily through the fins. This is particularly effective in systems with low-to-medium velocity cooling fans.
#### B. The pushPIN™ Attachment
This model utilizes the **pushPIN™** system for mounting to the PCB.
* **Spring-loaded mechanism:** Ensures consistent pressure across the interface of the chip and the heat sink.
* **Reliability:** It is more secure than thermal adhesive (tape) and protects the component from vibration and mechanical shock.
#### C. Thermal Interface Material (TIM)
The part typically comes with **T766** pre-applied. This is a high-performance thermal phase-change material that fills microscopic air gaps between the chip surface and the aluminum base to maximize heat transfer.
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### 3. Application Use Cases
This component is generally used for small, high-heat-generating electronic chips, such as:
1. **ASICs and FPGAs:** Used in telecommunications and data processing.
2. **Power Converters:** Managing heat in compact DC-DC converters.
3. **Processors:** Cooling embedded CPUs in industrial computing.
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### 4. Part Number Decoding
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer: Advanced Thermal Solutions |
| **20B** | Series / Product Family |
| **77** | Height/Design Variant |
| **C2** | Color/Finish (Blue Anodized) |
| **R0** | RoHS Compliance / Revision level |
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What are the different types of pushPIN materials available for this heat sink?
- ⤷ How does the thermal resistance change as air velocity increases?
- ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied T766?