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  • ATS-20B-77-C2-R0

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    The **ATS-20B-77-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the "maxiFLOW" product line, designed to optimize airflow and heat dissipation for electronic components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Base Dimensions** | 25mm x 25mm | | **Height** | 30mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 9.30°C/W (Unducted flow) | | **Pressure Drop** | 0.15 inH2O @ 200 LFM | --- ### 2. Design and Component Breakdown #### A. The Fin Geometry (maxiFLOW™) Unlike traditional straight-fin heat sinks, the ATS-20B-77-C2-R0 uses a **tapered fin design**. This increases the surface area while reducing pressure drop, allowing air to flow more easily through the fins. This is particularly effective in systems with low-to-medium velocity cooling fans. #### B. The pushPIN™ Attachment This model utilizes the **pushPIN™** system for mounting to the PCB. * **Spring-loaded mechanism:** Ensures consistent pressure across the interface of the chip and the heat sink. * **Reliability:** It is more secure than thermal adhesive (tape) and protects the component from vibration and mechanical shock. #### C. Thermal Interface Material (TIM) The part typically comes with **T766** pre-applied. This is a high-performance thermal phase-change material that fills microscopic air gaps between the chip surface and the aluminum base to maximize heat transfer. --- ### 3. Application Use Cases This component is generally used for small, high-heat-generating electronic chips, such as: 1. **ASICs and FPGAs:** Used in telecommunications and data processing. 2. **Power Converters:** Managing heat in compact DC-DC converters. 3. **Processors:** Cooling embedded CPUs in industrial computing. --- ### 4. Part Number Decoding | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **20B** | Series / Product Family | | **77** | Height/Design Variant | | **C2** | Color/Finish (Blue Anodized) | | **R0** | RoHS Compliance / Revision level |
    ✨ Follow-up Questions
    • ⤷ What are the different types of pushPIN materials available for this heat sink?
    • ⤷ How does the thermal resistance change as air velocity increases?
    • ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied T766?