## Technical Overview: ATS-20B-87-C2-R0 The **ATS-20B-87-C2-R0** is a high-performance **heat sink** component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, designed specifically for high-efficiency cooling of electronic components such as CPUs, GPUs, and FPGAs. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Dimensions (L x W x H)** | 37.00mm x 37.00mm x 24.50mm | | **Attachment Method** | pushPIN™ (Brass Pins) | | **Thermal Resistance** | 2.72 °C/W @ 200 LFM | | **Spring Type** | Stainless Steel (Blue) | --- ### 2. Design Features The part is engineered for optimal thermal management in restricted spaces: * **Tapered Fin Design:** The "maxiFLOW" geometry features a spread-fin pattern that increases surface area while reducing pressure drop, allowing air to flow more easily through the sink. * **pushPIN™ Attachment:** This model uses a standardized mounting system. It features a brass pin and a blue spring mechanism that ensures a specific, consistent pressure against the electronic component for maximum heat transfer. * **Pre-Applied Thermal Interface Material (TIM):** This specific part number usually comes with a pre-applied high-performance thermal pad or grease (T766), simplifying the assembly process. --- ### 3. Thermal Performance Comparison Performance is dependent on airflow (Measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 4.67 | | 200 (1.0 m/s) | 2.72 | | 400 (2.0 m/s) | 1.81 | | 600 (3.0 m/s) | 1.43 | --- ### 4. Applications * **Networking Equipment:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Heat dissipation for MOSFETs and power ICs. * **Computing:** Secondary cooling for chipsets on motherboards.