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  • ATS-20B-88-C2-R0

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    The **ATS-20B-88-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ## 1. Technical Specifications The following table summarizes the core physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Thermal Resistance** | 3.32 °C/W (at 200 LFM) | | **Hardware Included** | Springs and Plastic Pins | --- ## 2. Key Electronic & Mechanical Features ### A. maxiFLOW™ Fin Geometry The "88" in the part number refers to a specific fin design. The fins are tapered and spread outward to maximize the surface area and increase air turbulence. This is critical for electronic components that generate high heat in small footprints. ### B. pushPIN™ Attachment Unlike adhesive tapes that can degrade over time due to heat, the **ATS-20B-88-C2-R0** uses a mechanical push-pin system. * **Spring-loaded:** Ensures consistent pressure between the heat sink and the electronic chip, which is vital for optimal thermal transfer. * **Reliability:** Provides a secure mount that resists shock and vibration. ### C. Thermal Interface Material (TIM) The "R0" suffix usually denotes the specific type of thermal interface material pre-applied to the base of the heat sink. This eliminates the need for manual application of thermal paste, ensuring a uniform and air-bubble-free contact with the component. --- ## 3. Application Use Cases This part is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed networking processors. 2. **Embedded Systems:** For industrial PCs where space is limited but heat dissipation is high. 3. **Power Supplies:** Cooling MOSFETs or power regulators that are mounted on PCBs. --- ## 4. Dimensional Diagram (Approximate) ```text 40.00 mm (Width) ___________________ | | | ||||||||||||| | 40.00 mm (Length) | ||||||||||||| | |___________________| [ Fins ] _____________________ |_____________________| 15.00 mm (Height) ```
    ✨ Follow-up Questions
    • ⤷ What is the significance of the 'C2' code in the part number?
    • ⤷ Can this heat sink be used with a fan for active cooling?
    • ⤷ What is the recommended PCB hole size for the pushPIN attachment?