The **ATS-20B-95-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs on a Printed Circuit Board (PCB). --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-20B-95-C2-R0 | | **Heatsink Type** | Push-Pin (Aluminum) | | **Fin Style** | Straight Fin | | **Dimensions (L x W x H)** | 40mm x 40mm x 30mm | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Attachment Method** | Plastic Push-Pins & Brass Springs | --- ### 2. Key Electronic Features #### A. Thermal Resistance This part is designed to dissipate heat generated by electronic semiconductors. Its performance varies based on the airflow (CFM) within the electronic enclosure: * **Low Airflow:** Higher thermal resistance (e.g., @ 200 LFM, resistance is approx. 1.70 °C/W). * **High Airflow:** Lower thermal resistance (e.g., @ 700 LFM, resistance drops to approx. 0.80 °C/W). #### B. Attachment Mechanism (Push-Pin) The "20B" series utilizes a **push-pin and spring** system. This is critical for electronics because: * **Constant Pressure:** The springs ensure even pressure across the semiconductor die, maximizing heat transfer. * **Reliability:** Unlike adhesive tapes, push-pins offer a secure mechanical connection that survives high-vibration environments. * **Standardized Holes:** It requires pre-drilled holes in the PCB (usually 3.0mm diameter). #### C. Thermal Interface Material (TIM) The **C2** designation indicates that the heatsink comes pre-applied with **T766 phase-change material**. This eliminates the need for manual thermal paste application, reducing assembly time and ensuring a thin, void-free bond between the electronic chip and the aluminum base. --- ### 3. Applications in Electronics * **Embedded Systems:** Cooling microprocessors in industrial controllers. * **Telecommunications:** Managing heat in high-speed networking switches. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.