The **ATS-20B-97-C2-R0** is a high-performance electronic component belonging to the thermal management category. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other heat-generating electronic parts. Below is a detailed breakdown of its specifications and features. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Part Number** | ATS-20B-97-C2-R0 | | **Attachment Type** | Push-Pin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 3.30°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | --- ### 2. Physical Design & Construction * **Fin Style:** This model features a **Straight Fin** design. This is optimized for airflow in a single direction, providing a high surface area for heat dissipation without significantly increasing the component's footprint. * **Material:** It is made from **Aluminum 6063**, which is the industry standard for thermal conductivity, weight efficiency, and corrosion resistance. * **Coating:** The "Blue Anodized" finish is not just aesthetic; it provides an extra layer of protection against environmental wear and slightly improves radiant heat transfer. --- ### 3. Attachment Mechanism: pushPIN™ The "pushPIN™" system is a signature feature of this component. It replaces traditional adhesive tapes or fragile clips with a more robust solution: * **Compression Spring:** Ensures consistent pressure (clamping force) on the processor, which maximizes thermal transfer between the chip and the heatsink. * **Pre-assembled:** It usually comes with the push-pins and springs pre-installed for rapid assembly on the production line. * **Thermal Interface Material (TIM):** Most versions of this part come with a pre-applied high-performance thermal pad or grease (Phase Change Material) to bridge the air gap between the component and the sink. --- ### 4. Thermal Performance The performance of the ATS-20B-97-C2-R0 is highly dependent on the velocity of the air moving through the fins (measured in Linear Feet per Minute - LFM): * **Low Airflow (100 LFM):** ~3.30°C/W * **High Airflow (700 LFM):** ~0.77°C/W *Note: A lower °C/W value indicates better cooling performance.* --- ### 5. Common Applications * **BGA (Ball Grid Array) Cooling:** Used for CPUs, GPUs, and FPGAs. * **Telecommunications:** Cooling chips in routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and automation controllers where space is constrained (10mm height).