The **ATS-20B-98-C2-R0** is a high-performance electronic thermal management component, specifically an aluminum heat sink designed for cooling integrated circuits (ICs) and other electronic components. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum (Blue Anodized) | | **Attachment Type** | Push-Pin | | **Thermal Resistance** | 15.31°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Pitch** | Fine Pitch | --- ### 2. Key Design Elements #### A. Fin Pattern The part utilizes a **Cross-Cut** fin design. This layout allows for multi-directional airflow, making it highly effective in compact enclosures where air may not be moving in a single linear path. #### B. pushPIN™ Attachment System Instead of using messy thermal adhesives or fragile clips, this part uses a mechanical push-pin system: * **Compression Springs:** Provide precise pressure to ensure maximum surface contact between the heat sink and the component. * **Ease of Installation:** Allows for standardized hole patterns on the PCB for rapid assembly and rework. #### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes pre-applied with a thermal interface material (like a phase-change material or high-conductivity pad). This eliminates the need for manual application of thermal grease. --- ### 3. Applications This specific heat sink is commonly found in the following electronic sectors: * **Telecommunications:** Cooling high-speed processing chips in routers and switches. * **Embedded Systems:** Industrial PCs where vertical space is limited (15mm height). * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.